公开(公告)号：DE2658133A1

公开(公告)日：1977-07-07

申请号：DE2658133

申请日：1976-12-22

Applicant: IBM

Inventor： CASTELLANI EUGENE EDWARD ,  MCCAFFREY PATRICK MICHAEL ,  PFEIFFER ALOYSIUS THEODORE ,  ROMANKIW LUBOMYR TARAS

IPC: G03F7/038 ,  G03F1/20 ,  G03F7/004 ,  H01L21/027 ,  H01L21/18

Abstract: A method of constructing a relatively thick, self-supporting mask suitable for electron beam projection processes. Thickness is achieved by multiple steps of coating with resist, exposure, development and plating. First an intermediate or lift off layer is deposited on a substrate. A plating or a cathode layer may then be deposited. Resist is then applied. A first mask layer comprises metal plated in accordance with the first pattern. For the second exposure a geometrically similar pattern is employed to generate larger apertures. Thus, if the first mask layer has 0.20 mil apertures, the second layer might have corresponding 0.21 mil to 0.22 mil apertures. For initial mask patterns of about 2 mil the second layer might be 2.02 mils. If desired, a third exposure can be employed with a third pattern, similar to the first two, but having larger apertures (by 0.02 to 0.03 mils) than the second pattern.

公开(公告)号：DE3472319D1

公开(公告)日：1988-07-28

申请号：DE3472319

申请日：1984-03-05

Applicant: IBM

Inventor： ANDERSON NATHANIEL CARL ,  DABY LARRY FUGENE ,  JOHNSON GENE ALVIN ,  MCCAFFREY PATRICK MICHAEL

IPC: G11B5/31 ,  G11B5/127

Abstract: A film transducer head design is formed on a substrate where the first yoke layer and electric terminal strip that connects the coil center pad to the head exterior are formed at the same time followed by successive layers that form the transducer gap, coil insulation, coil, coil insulation and the second yoke layer. This sequence allows the coil to be tested immediately after deposition of the coil material and at a time in the fabrication sequence when it can be reworked or replaced if a discontinuity (open) or shorted turn(s) is (are) identified.

公开(公告)号：DE2604367A1

公开(公告)日：1976-08-26

申请号：DE2604367

申请日：1976-02-05

Applicant: IBM

Inventor： ANDERSON RONALD LEE ,  CASTELLANI EUGENE EVANS ,  MCCAFFREY PATRICK MICHAEL ,  ROMANKIV LUBOMYR TARAS

IPC: H01F1/147 ,  C21D6/00 ,  C22F1/10 ,  H01F1/14 ,  H01F10/00 ,  H01F10/14 ,  H01F41/14

公开(公告)号：DE3374485D1

公开(公告)日：1987-12-17

申请号：DE3374485

申请日：1983-01-26

Applicant: IBM

Inventor： ANDERSON NATHANIEL CARL ,  DABY LARRY EUGENE ,  GRAVDAHL VINCENT DEAN ,  MCCAFFREY PATRICK MICHAEL ,  MURRAY BRUCE ALLEN ,  WRIGHT BRUCE WAYNE

IPC: C23F4/00 ,  C23F1/00 ,  G03F7/00 ,  G11B5/127 ,  G11B5/133 ,  G11B5/193 ,  G11B5/31 ,  H01F41/34 ,  H01F41/14

Abstract: A process for producing a reactive ion-etched structure with height and width dimensions of the order of 25 microns or less on a ferrite substrate (12) surface is disclosed. A mask (18) of positive water saturated photoresist is formed on the substrate. A metal taken from the group consisting of nickel and a nickel-iron alloy is plated through the mask. The photoresist mask is removed to leave a pattern (20) in the plated metal. The ferrite substrate surface that is exposed by the pattern is reactive ion etched with a power density of more than 1w/cm 2 and a bias voltage less than -100 volts.

公开(公告)号：DE2720109A1

公开(公告)日：1977-12-22

申请号：DE2720109

申请日：1977-05-05

Applicant: IBM

Inventor： ANDERSON RONALD LEE ,  CASTELLANI EUGENE EVANS ,  MCCAFFREY PATRICK MICHAEL ,  ROMANKIW LUBOMYR TARAS

IPC: H05K3/18 ,  C25D5/02 ,  H01L21/768 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  C25D7/12 ,  H01L21/88