公开(公告)号：JPH02173129A

公开(公告)日：1990-07-04

申请号：JP27620489

申请日：1989-10-25

Applicant: IBM

Inventor： MORISU ANSHIERU ,  UOORUTAA POORU PAUROUSUKII

IPC: C08J7/12 ,  C08J7/14 ,  C08L79/08 ,  C23C14/02 ,  C23C14/20 ,  H05K3/38

公开(公告)号：JPH04304696A

公开(公告)日：1992-10-28

申请号：JP31880791

申请日：1991-12-03

Applicant: IBM

Inventor： JIYON JIYOZEFU GURENINGU ,  UOORUTAA POORU PAUROUSUKII ,  KENISU JIYOOJI SAKORAFUOSU

IPC: C23F1/00 ,  H01L21/48 ,  H01L23/12 ,  H05K3/07 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38

Abstract: PURPOSE: To manufacture a microelectronic package having a copper circuit on a dielectric substrate by bringing a chromium adhesive layer, while sustaining in positive state, into contact with an aqueous sulfuric acid electrolyte thereby removing the chromium adhesive layer material from the dielectric substrate. CONSTITUTION: A chromium adhesive layer is bonded onto a dielectric substrate and a copper species layer is bonded onto the chromium adhesive layer. The chromium adhesive layer is held electrolytically in series with a counter electrode. While sustaining the chromium adhesive layer positive with respect to the counter electrode, the chromium adhesive layer is brought into contact with an aqueous sulfuric acid electrolyte and the chromium adhesive layer material is removed from the dielectric substrate thus manufacturing a microelectronic package 1 having a copper surface circuit. The circuit package 1 comprises a surface circuit 31 in the form of a pair of polymer layers 21 having a through hole 41 and at least one integrated circuit chip 51.

公开(公告)号：JPH02202980A

公开(公告)日：1990-08-13

申请号：JP29515889

申请日：1989-11-15

Applicant: IBM

Inventor： JIYON JIYOZEFU GURENINGU ,  KARIN JIIN JIYONSON ,  UOORUTAA POORU PAUROUSUKII ,  KENESU JIYOOJI SAKORAFUOSU

IPC: G02F1/1337 ,  C08J7/12 ,  C08J7/14 ,  C09K13/02 ,  C09K13/04 ,  G03F7/32 ,  H01L21/311 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40

公开(公告)号：JPH02190475A

公开(公告)日：1990-07-26

申请号：JP30229589

申请日：1989-11-22

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOZEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH06322547A

公开(公告)日：1994-11-22

申请号：JP21022593

申请日：1993-08-25

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOSEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH0248666A

公开(公告)日：1990-02-19

申请号：JP14856189

申请日：1989-06-13

Applicant: IBM

Inventor： SUTEIIBUN RINTSU BAADO ,  KURAUDEIUSU FUEEGAA ,  JIYON JIYOSEFU GURENINGU ,  GARESU JIEFURII HOKAMU ,  SUTEIIBUN AARU MORISU ,  UOORUTAA POORU PAUROUSUKII ,  JIYON JIEIMUZU RITSUKO ,  PIITAA SUROUTA JIYUNIA ,  RANDEI UIRIAMU SUNAIDAA

IPC: G03F7/26 ,  C08J7/12 ,  G03F7/40 ,  H01L21/306 ,  H01L21/311 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10

Abstract: PURPOSE: To unnecessitate the use of dangerous or explosive chemicals in etching a polyimide layer by bringing the layer into successive contact with an aq. soln., an acid and a soln. CONSTITUTION: A satisfactorily or practically satisfactorily cured polyimide layer is brought into successive contact with an aq. metal. hydroxide soln., an acid and a metal hydroxide soln. The transfer of chemicals from one bath to other bath by which the service life of the baths is shortened by neutralization is suppressed and slight washing can be carried out.