公开(公告)号：WO2012006002A3

公开(公告)日：2012-04-19

申请号：PCT/US2011041970

申请日：2011-06-27

Applicant: IBM ,  BARTLEY GERALD K ,  MOTSCHMAN DAVID R ,  SIKKA KAMAL K ,  WAKIL JAMIL A ,  WEI XIAOJIN ,  ZHENG JIANTAO

Inventor： BARTLEY GERALD K ,  MOTSCHMAN DAVID R ,  SIKKA KAMAL K ,  WAKIL JAMIL A ,  WEI XIAOJIN ,  ZHENG JIANTAO

IPC: H01L23/34 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L23/49827 ,  H01L23/055 ,  H01L23/14 ,  H01L23/147 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/433 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/3003 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/3303 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/16195 ,  H01L2924/163 ,  H01L2924/167 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.

Abstract translation: 提供管芯堆叠封装并且包括衬底，一堆计算部件，至少一个与该叠层热连通的热板以及支撑在该衬底上以围绕该叠层和该至少一个热板从而围绕该盖板的盖子 限定从所述计算部件之一延伸到所述盖子的第一传热路径，所述第一传热路径经由所述至少一个热板和耦合到所述盖子和所述至少一个热板的表面的翅片;以及第二传热路径， 不通过所述至少一个热板的所述计算组件中的一个计算组件。

公开(公告)号：GB2495454A

公开(公告)日：2013-04-10

申请号：GB201301231

申请日：2011-06-27

Applicant: IBM

Inventor： BARTLEY GERALD K ,  MOTSCHMAN DAVID R ,  SIKKA KAMAL K ,  WAHIL JAMIL A ,  WEI XIAOJIN ,  ZHENG JIANTAO

IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065

Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.

公开(公告)号：GB2495454B

公开(公告)日：2015-06-10

申请号：GB201301231

申请日：2011-06-27

Applicant: IBM

Inventor： BARTLEY GERALD K ,  MOTSCHMAN DAVID R ,  SIKKA KAMAL K ,  WAHIL JAMIL A ,  WEI XIAOJIN ,  ZHENG JIANTAO

IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065