公开(公告)号：GB2495454A

公开(公告)日：2013-04-10

申请号：GB201301231

申请日：2011-06-27

Applicant: IBM

Inventor： BARTLEY GERALD K ,  MOTSCHMAN DAVID R ,  SIKKA KAMAL K ,  WAHIL JAMIL A ,  WEI XIAOJIN ,  ZHENG JIANTAO

IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065

Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.

公开(公告)号：GB2495454B

公开(公告)日：2015-06-10

申请号：GB201301231

申请日：2011-06-27

Applicant: IBM

Inventor： BARTLEY GERALD K ,  MOTSCHMAN DAVID R ,  SIKKA KAMAL K ,  WAHIL JAMIL A ,  WEI XIAOJIN ,  ZHENG JIANTAO

IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065