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公开(公告)号:HUT76992A
公开(公告)日:1998-01-28
申请号:HU9701699
申请日:1995-09-20
Applicant: IBM
Inventor: BRADY MICHAEL JOHN , COFINO THOMAS ANTHONY , HEINRICH HARLEY KENT , JOHNSON GLEN WALDEN , MOSKOWITZ PAUL ANDREW , MURHPY PHILIP , WALKER GEORGE FREDERICK
Abstract: A radio frequency tag and its antenna structure are manufactured using wire bonding. A semiconductor chip is placed and attached upon an organic film substrate. The antenna consisting of one or more thin wires is created on the substrate and connected to contacts on the chip using a wire bonding machine. Alternate embodiments using a plurality of semiconductors on a strip of substrate are also disclosed. The chip may be protected with encapsulant and the chip and antenna combination may be sealed between layers of organic film.