公开(公告)号：SG33451A1

公开(公告)日：1996-10-18

申请号：SG1995001057

申请日：1995-08-04

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ANTHONY ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  MURPHY PHILIP ,  WALKER GEORGE FREDERICK

IPC: G06K19/077 ,  H04B7/00

公开(公告)号：ZA957079B

公开(公告)日：1996-03-11

申请号：ZA957079

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  COFINO THOMAS ,  JOHNSON GLEN WALDEN ,  WALKER GEORGE FREDERICK

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59 ,  G01V ,  G01S ,  H04B ,  H01L

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.

公开(公告)号：ZA9507079B

公开(公告)日：1996-03-11

申请号：ZA9507079

申请日：1995-08-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  HEINRICH HARLEY KENT ,  MOSKOWITZ PAUL ANDREW ,  COFINO THOMAS ,  JOHNSON GLEN WALDEN ,  WALKER GEORGE FREDERICK

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59 ,  G01V ,  G01S ,  H01L ,  H04B

CPC classification number: H01Q1/2225 ,  G01V15/00 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/07779 ,  G06K19/07786 ,  H01L2224/4813 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  Y10T156/1089 ,  Y10T156/1093 ,  H01L2924/00

公开(公告)号：ZA9507078B

公开(公告)日：1996-03-11

申请号：ZA9507078

申请日：1995-08-23

Applicant: IBM

Inventor： MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM ,  BRADY MICHAEL JOHN

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59 ,  G01V ,  G01S ,  H01L ,  H04B

CPC classification number: G06K19/07758 ,  G06K19/07718 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07786 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49137 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2075 ,  H01L2924/2076 ,  H01L2924/20754 ,  H01L2224/05599 ,  H01L2924/01005

公开(公告)号：DE69324959T2

公开(公告)日：1999-12-02

申请号：DE69324959

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：SG46938A1

公开(公告)日：1998-03-20

申请号：SG1995000278

申请日：1995-04-18

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59 ,  H01Q23/00

Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

公开(公告)号：PL318978A1

公开(公告)日：1997-07-21

申请号：PL31897895

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.

公开(公告)号：PL318977A1

公开(公告)日：1997-07-21

申请号：PL31897795

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

公开(公告)号：DE3365521D1

公开(公告)日：1986-10-02

申请号：DE3365521

申请日：1983-02-23

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  MEYERSON BERNARD STEELE ,  WARLAUMONT JOHN MICHAEL

IPC: C01B33/02 ,  G03F1/22 ,  H01L21/027 ,  G03F1/00

Abstract: An improved X-ray lithography mask has been fabricated by forming an X-ray absorbing lithography pattern on a supporting foil of hydrogenated amorphous carbon. The substrate foil is formed by depositing a carbon film in the presence of hydrogen onto a surface having a temperature below 375 DEG C. The hydrogen concentration is maintained sufficiently high that the resulting film has at least one atom percent of hydrogen. A film having about 20 atom percent of hydrogen is preferred. While impurities are permitted, impurities must be maintained at a level such that the optical bandgap of the resulting film is at least one electron volt. A film with an optical bandgap of about 2 electron volts is preferred.

公开(公告)号：HUT76997A

公开(公告)日：1998-01-28

申请号：HU9700404

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  COFINO THOMAS ,  HEINRICH HARLEY KENT ,  JOHNSON GLEN WALDEN ,  MOSKOWITZ PAUL ANDREW ,  WALKER GEORGE FREDERICK

IPC: H01Q1/40 ,  G01V15/00 ,  G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/26 ,  H01Q21/28 ,  H04B1/38 ,  H04B1/59

Abstract: A radiofrequency identification tag has a semiconductor chip with radio frequency circuit, logic, memory circuits, and further includes an antenna that is mounted on a substrate. The antenna may be used by the chip to modulate an incident RF signal to transfer information to a base station. The antenna comprises one or more lengths of thin wire that are connected directly to the chip by means of wire bonding. The chip and antenna combination can be sealed with an organic film covering.