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    Process for forming a ceramic substrate
    1.
    发明授权
    Process for forming a ceramic substrate 失效
    陶瓷基板的形成方法

    公开(公告)号：US3899554A

    公开(公告)日：1975-08-12

    申请号：US42504073

    申请日：1973-12-14

    Applicant: IBM

    Inventor： KAISER HAROLD D ,  NUFER ROBERT W

    IPC: C04B33/26 ,  C04B35/622 ,  C04B35/634 ,  H01B3/00 ,  H05K1/03 ,  H05K3/12 ,  B29D27/04 ,  C04B33/28 ,  C04B39/12 ,  H01L7/00

    CPC classification number: C04B35/6342 ,  B32B3/266 ,  B32B7/12 ,  B32B43/006 ,  B32B2038/042 ,  B32B2264/107 ,  B32B2315/02 ,  C04B35/634

    Abstract: Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate with a binder resin soluble in an azeotropic mixture which is formed from a solvent for the binder resin and a non-solvent in which the resin is at most only slightly soluble, which on evaporation of said azeotropic mixture forms said structure.

    Abstract translation: 制备由具有均匀微孔结构的生片形成的烧结陶瓷电介质，其提供均匀的介电性能和用于将堆叠的生片层压到可以设置有延伸在其中的电导体的内部图案的单一层压体的压缩性。 该结构通过将陶瓷颗粒与可溶于共沸混合物的粘合剂树脂混合而获得，所述共沸混合物由用于粘合剂树脂的溶剂和其中树脂最多只有微溶性的非溶剂形成，其在所述共沸蒸发 混合物形成所述结构。

    CERAMIC DIELECTRICS
    2.
    发明专利
    CERAMIC DIELECTRICS 未知

    公开(公告)号：CA1037691A

    公开(公告)日：1978-09-05

    申请号：CA213801

    申请日：1974-11-15

    Applicant: IBM

    Inventor： KAISER HAROLD D ,  NUFER ROBERT W

    IPC: C04B33/26 ,  C04B35/622 ,  C04B35/634 ,  H01B3/00 ,  H05K1/03 ,  H05K3/12 ,  C04B33/28

    Abstract: CERAMIC DIELECTRICS Production of a sintered ceramic dielectric formed from a green sheet having a uniform microporous structure providing uniform dielectric properties and compressibility for lamination of stacked green sheets into a unitary laminate which may be provided with an internal pattern of electrical conductors extending therein. The structure is obtained by blending the ceramic particulate with a binder resin soluble in an azeotropic mixture which is formed from a solvent for the binder resin and a non-solvent in which the resin is at most only slightly soluble, which on evaporation of said azeotropic mixture forms said structure.

    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS
    3.
    发明专利
    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS 未知

    公开(公告)号：CA1312405C

    公开(公告)日：1993-01-05

    申请号：CA615552

    申请日：1989-11-07

    Applicant: IBM

    Inventor： HERRON LESTER W ,  KUMAR ANANDA H ,  NUFER ROBERT W

    IPC: H01L21/48

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics. FI9-84-010B

    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS
    6.
    发明专利
    DIFFUSION ISOLATION LAYER FOR MASKLESS CLADDING PROCESS 未知

    公开(公告)号：CA1267990A

    公开(公告)日：1990-04-17

    申请号：CA490982

    申请日：1985-09-18

    Applicant: IBM

    Inventor： HERRON LESTER W ,  KUMAR ANANDA H ,  NUFER ROBERT W

    IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  B05D3/12 ,  C23C14/00 ,  B05D5/12

    Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

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