公开(公告)号：JP2000357874A

公开(公告)日：2000-12-26

申请号：JP2000149183

申请日：2000-05-22

Applicant: IBM

Inventor： FASANO BENJAMIN V ,  INDYK RICHARD F ,  KAMATH SUNDAR M ,  KNICKERBOCKER JOHN U ,  LANGENTHAL SCOTT I ,  O'CONNOR DANIEL P ,  REDDY SRINIVASA S N

IPC: H05K1/11 ,  B32B18/00 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic substrate of low thermal-expansion factor by providing a plurality of layers of a multi-layer ceramic material comprising a sealing layer and a via hole which, filled with a metal material, comprises no ceramic material. SOLUTION: At a via hole part 24 of a first layer 12, a via hole 26 which, filled with a metal material, comprises no ceramic material is formed. A via hole 28 comprising a mixture of metal material and ceramic material is inserted in a second layer 14, and the via hole 28 so seals a ceramic substrate 10 not to penetrate deeper than the first layer 12. For a third layer 16, a via hole 30 comprising no ceramic material is formed related to the via hole 26 in the first layer 12. Thus, the via holes 26, 28, and 30 of the plurality of layers 12, 14, and 16 allows transmission of electric signal and power between layers, sealing an outside part layer 20 with a via hole 38.