公开(公告)号：DE3160889D1

公开(公告)日：1983-10-27

申请号：DE3160889

申请日：1981-01-08

Applicant: IBM

Inventor： MANSURIA MOHANLAL SAVJI ,  OSTERGREN CARL DAVID

IPC: H05K7/20 ,  H01L23/433 ,  H01L23/473 ,  H01L23/42

Abstract: Heat transfer connection in a cooling module wherein at least one semiconductor chip (10) to be cooled is supported on a substrate (12) portion of the module. The provision of thin leaf or rectangularly shaped members (21) each having a relatively long thin planar surface in thermal contact with a planar surface of the chip (10) to be cooled, said thin leaf shaped members (12) each being contained within a discrete narrow, relatively deep slot (20, 20A) within a module cover (16), each of said thin leaf shaped members (21) being spring (22) biased in thermal contact with said planar surface of said chip (10), whereby the relatively long thin planar surface of each thin leaf shaped member (21) is maintained in intimate thermal contact with the planar surface of the chip (10).

公开(公告)号：DE3573193D1

公开(公告)日：1989-10-26

申请号：DE3573193

申请日：1985-06-14

Applicant: IBM

Inventor： OSTERGREN CARL DAVID ,  PAIVANAS JOHN ANGELO

IPC: H01L23/36 ,  H01L23/40 ,  H01L23/433

公开(公告)号：DE3278000D1

公开(公告)日：1988-02-18

申请号：DE3278000

申请日：1982-07-16

Applicant: IBM

Inventor： MEAGHER RALH ERNEST ,  OSTERGREN CARL DAVID

IPC: H01L23/40 ,  H01L23/433 ,  H01L23/42

公开(公告)号：DE3067705D1

公开(公告)日：1984-06-07

申请号：DE3067705

申请日：1980-10-15

Applicant: IBM

Inventor： LEAYCRAFT EDGAR CRAWFORD ,  OKTAY SEVGIN ,  OSTERGREN CARL DAVID

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/467 ,  H01L23/46 ,  H01L23/36