公开(公告)号：AU6855790A

公开(公告)日：1991-08-01

申请号：AU6855790

申请日：1990-12-28

Applicant: IBM

Inventor： MASLEID ROBERT PAUL ,  PATEL PARSOTAM TRIKAM

IPC: H01L21/822 ,  G06F17/50 ,  H01L21/82 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/04 ,  H01L27/092 ,  H01L27/118 ,  H01L27/10

Abstract: In accordance with the teachings of this invention a method for positioning components of input/output circuits is provided. These components are positioned on a semiconductor substrate. The semiconductor substrate includes other than input/output circuits. Each input/output circuit is provided for processing a single bit of information within a data word containing multiple bits. The method includes the step of (1) dividing each input/output circuit into groups containing similar functional subcomponents; (2) forming a vertical column of subcomponents for each input/output circuit and connecting these subcomponents to perform the function; (3) placing said columns in adjacency to form a plurality of columns with like subcomponents immediately adjacent to each other forming row groups of said like subcomponents; and (4) forming guard rings around the subcomponent row groups if required. Also in accordance with this invention, a group of input/output circuits is provided. The group is positioned on an integrated circuit substrate that contains other than input/output circuits. The input/output circuits group includes a plurality of columns of circuitry component where each column represents all of the input/output circuit components for processing a single bit of information in a group of bits, a plurality of rows positioned across the columns containing like devices among said input/output circuits, and at least one guard ring containing at least one of the plurality of rows.

公开(公告)号：DE3170944D1

公开(公告)日：1985-07-18

申请号：DE3170944

申请日：1981-10-09

Applicant: IBM

Inventor： KALTER HOWARD LEO ,  KOTECHA HARISH NARANDAS ,  PATEL PARSOTAM TRIKAM

IPC: H01L27/112 ,  G11C14/00 ,  H01L21/8246 ,  H01L21/8247 ,  H01L29/788 ,  H01L29/792 ,  G11C11/00

Abstract: The non-volatile semiconductor memory includes a one device dynamic volatile memory cell having a storage capacitor (C5) with a plate (12) and a storage node (10) coupled to a non-volatile device having a floating gate (FG), a control gate (24) and a voltage divider (16) having first and second serially-connected capacitors (C1, C2), with the floating gate (FG) being disposed at the common point between the first and second capacitors. The plate (12) of the storage capacitor is connected to a reference voltage source. The control gate (24) is preferably capacitively coupled to the floating gate (FG) through the first (C1) capacitor which includes a dual charge or electron injector structure (26). The capacitance of the first capacitor (C1) has a value substantially less than that of the second capacitor (C2).

公开(公告)号：DE3172502D1

公开(公告)日：1985-11-07

申请号：DE3172502

申请日：1981-06-10

Applicant: IBM

Inventor： BERGERON DAVID LEO ,  PATEL PARSOTAM TRIKAM

IPC: H01L21/331 ,  H01L21/8222 ,  H01L21/8226 ,  H01L27/07 ,  H01L27/082 ,  H01L29/73 ,  H03K19/013 ,  H03K19/088 ,  H01L27/06 ,  H01L29/06

公开(公告)号：DE69128434D1

公开(公告)日：1998-01-29

申请号：DE69128434

申请日：1991-01-04

Applicant: IBM

Inventor： MASLEID ROBERT PAUL ,  PATEL PARSOTAM TRIKAM

IPC: G06F17/50 ,  H01L21/82 ,  H01L21/822 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/04 ,  H01L27/092 ,  H01L27/118 ,  H01L27/02

Abstract: In accordance with the teachings of this invention a method for positioning components of input/output circuits is provided. These components are positioned on a semiconductor substrate. The semiconductor substrate includes other than input/output circuits. Each input/output circuit is provided for processing a single bit of information within a data word containing multiple bits. The method includes the step of (1) dividing each input/output circuit into groups containing similar functional subcomponents; (2) forming a vertical column of subcomponents for each input/output circuit and connecting these subcomponents to perform the function; (3) placing said columns in adjacency to form a plurality of columns with like subcomponents immediately adjacent to each other forming row groups of said like subcomponents; and (4) forming guard rings around the subcomponent row groups if required. Also in accordance with this invention, a group of input/output circuits is provided. The group is positioned on an integrated circuit substrate that contains other than input/output circuits. The input/output circuits group includes a plurality of columns of circuitry component where each column represents all of the input/output circuit components for processing a single bit of information in a group of bits, a plurality of rows positioned across the columns containing like devices among said input/output circuits, and at least one guard ring containing at least one of the plurality of rows.

公开(公告)号：SG44408A1

公开(公告)日：1997-12-19

申请号：SG1996000215

申请日：1991-01-04

Applicant: IBM

Inventor： MASLEID ROBERT PAUL ,  PATEL PARSOTAM TRIKAM

IPC: G06F17/50 ,  H01L21/82 ,  H01L21/822 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/04 ,  H01L27/092 ,  H01L27/118 ,  H01L27/02

Abstract: In accordance with the teachings of this invention a method for positioning components of input/output circuits is provided. These components are positioned on a semiconductor substrate. The semiconductor substrate includes other than input/output circuits. Each input/output circuit is provided for processing a single bit of information within a data word containing multiple bits. The method includes the step of (1) dividing each input/output circuit into groups containing similar functional subcomponents; (2) forming a vertical column of subcomponents for each input/output circuit and connecting these subcomponents to perform the function; (3) placing said columns in adjacency to form a plurality of columns with like subcomponents immediately adjacent to each other forming row groups of said like subcomponents; and (4) forming guard rings around the subcomponent row groups if required. Also in accordance with this invention, a group of input/output circuits is provided. The group is positioned on an integrated circuit substrate that contains other than input/output circuits. The input/output circuits group includes a plurality of columns of circuitry component where each column represents all of the input/output circuit components for processing a single bit of information in a group of bits, a plurality of rows positioned across the columns containing like devices among said input/output circuits, and at least one guard ring containing at least one of the plurality of rows.