公开(公告)号：CH614070A5

公开(公告)日：1979-10-31

申请号：CH593977

申请日：1977-05-12

Applicant: IBM

Inventor： CHANG KENNETH ,  PITTLER MARVIN STANLEY

IPC: H01L21/30 ,  H01L21/027 ,  H01L21/306 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/308

公开(公告)号：DE3279431D1

公开(公告)日：1989-03-09

申请号：DE3279431

申请日：1982-12-20

Applicant: IBM

Inventor： MASTER RAJ NAVINCHANDRA ,  PITTLER MARVIN STANLEY ,  TOTTA PAUL ANTHONY ,  AINSLIE NORMAN GEORGE ,  PALMATEER PAUL HARRY

IPC: B23K1/20 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/24 ,  H05K3/34 ,  H01L23/52

Abstract: In the process for joining metallic coated connector pins (20) to a multilayer ceramic substrate (10), contact areas on the substrate are formed by sequential coatings of molybdenum (12) and nickel (14), which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film (14) into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.

公开(公告)号：DE2723944A1

公开(公告)日：1978-01-05

申请号：DE2723944

申请日：1977-05-27

Applicant: IBM

Inventor： CHANG KENNETH ,  PITTLER MARVIN STANLEY

IPC: H01L21/30 ,  H01L21/027 ,  H01L21/306 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/52 ,  H05K3/00