公开(公告)号：JP2002043494A

公开(公告)日：2002-02-08

申请号：JP2001194587

申请日：2001-06-27

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a method for reducing and eliminating the strain of a plastic package. SOLUTION: A semiconductor module includes a semiconductor chip, a lead frame having a lead finger, and a down set member being in a mounting medium for reducing the strain and giving a flat package by balancing thermal stress between the lead finger and the mounting medium. The down set member may be the bent part of the lead frame. The down set member may be another body such as a dummy semiconductor chip.

公开(公告)号：JP2006013137A

公开(公告)日：2006-01-12

申请号：JP2004188327

申请日：2004-06-25

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ALLEN DUANE E ,  BURNOR BRIAN K ,  DOTOLO THOMAS A ,  GARDECKI LEONARD J ,  HAMMOND WILLIAM L ,  HORSFORD KIBBY B ,  RAMSEY CHARLES R

IPC: H01L21/60

CPC classification number: H01L2924/0002 ,  H01L2924/014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide the positioning of a mask and a substrate for a solder bump process.
SOLUTION: This system comprises a positioning fixture for temporarily holding the mask 145 and substrate 215 at mutual fixation positions, a holding means where a means 260 for holding the substrate with the reverse surface projects from the opening of a table and the opening of the fixture and is fixedly fitted onto a stage assembly 325, which can move in 1st and 2nd directions and rotate on an axis about the table, a means for temporarily fixing the fixture including the mask and substrate to the table, a means for controlling the means for temporary fixation so that a uniform force is generated around the peripheral part of the fixture, and a means for controlling the movement of the stage assembly in the 1st and 2nd directions and the rotation on the axis.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供用于焊料凸块工艺的掩模和基板的定位。 解决方案：该系统包括用于在相互固定位置暂时保持掩模145和基板215的定位夹具，保持装置，其中用于保持具有反面的基板的装置260从工作台的开口突出，并且开口 并且固定地安装到台架组件325上，台架组件325可以在第一和第二方向上移动并围绕桌子绕轴线旋转;用于将包括面罩和基板的固定装置临时固定到工作台的装置，用于控制的装置 用于临时固定的装置，使得在固定装置的周边部分周围产生均匀的力;以及用于控制台架组件在第一和第二方向上的运动以及轴线上的旋转的装置。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：BR0102606A

公开(公告)日：2002-02-13

申请号：BR0102606

申请日：2001-06-28

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L23/06

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

公开(公告)号：CA2350057A1

公开(公告)日：2001-12-28

申请号：CA2350057

申请日：2001-06-07

Applicant: IBM

Inventor： CALETKA DAVID V ,  LAJZA JOHN J JR ,  IRISH GARY H ,  CARPER JAMES L ,  RAMSEY CHARLES R ,  VADNAIS MICHAEL J ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  OSBORNE GORDON C JR ,  SMITH ROBERT M

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L23/02

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having le ad fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

公开(公告)号：MY119889A

公开(公告)日：2005-07-29

申请号：MYPI20012927

申请日：2001-06-21

Applicant: IBM

Inventor： CALETKA DAVID V ,  VADNAIS MICHAEL J ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M

IPC: H01L23/28 ,  H01L23/50 ,  H01L21/56 ,  H01L23/02 ,  H01L23/16 ,  H01L23/38 ,  H01L23/48 ,  H01L23/495

Abstract: A SEMICONDUCTOR MODULE INCLUDES A SEMICONDUCTOR CHIP, A LEAD FRAME HAVING LEAD FINGERS, AND A DOWN SET MEMBER WITHIN AN ENCAPSULANT FOR REDUCE WARPAGE AND PROVIDING A MORE PLANAR PACKAGE BY BALANCING THERMAL STRESS BETWEEN THE LEAD FINGERS AND THE ENCAPSULANT. THE DOWN SET MEMBER CAN BE A BENT PORTION OF THE LEAD FRAME. IT CAN ALSO BE A SEPARATE BODY, SUCH AS A DUMMY SEMICONDUCTOR CHIP.

公开(公告)号：HK1042591A1

公开(公告)日：2002-08-16

申请号：HK02104209

申请日：2002-06-03

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.