公开(公告)号：JP2002043494A

公开(公告)日：2002-02-08

申请号：JP2001194587

申请日：2001-06-27

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a method for reducing and eliminating the strain of a plastic package. SOLUTION: A semiconductor module includes a semiconductor chip, a lead frame having a lead finger, and a down set member being in a mounting medium for reducing the strain and giving a flat package by balancing thermal stress between the lead finger and the mounting medium. The down set member may be the bent part of the lead frame. The down set member may be another body such as a dummy semiconductor chip.

公开(公告)号：BR0102606A

公开(公告)日：2002-02-13

申请号：BR0102606

申请日：2001-06-28

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L23/06

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

公开(公告)号：CA2350057A1

公开(公告)日：2001-12-28

申请号：CA2350057

申请日：2001-06-07

Applicant: IBM

Inventor： CALETKA DAVID V ,  LAJZA JOHN J JR ,  IRISH GARY H ,  CARPER JAMES L ,  RAMSEY CHARLES R ,  VADNAIS MICHAEL J ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  OSBORNE GORDON C JR ,  SMITH ROBERT M

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L23/02

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having le ad fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

公开(公告)号：MY119889A

公开(公告)日：2005-07-29

申请号：MYPI20012927

申请日：2001-06-21

Applicant: IBM

Inventor： CALETKA DAVID V ,  VADNAIS MICHAEL J ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M

IPC: H01L23/28 ,  H01L23/50 ,  H01L21/56 ,  H01L23/02 ,  H01L23/16 ,  H01L23/38 ,  H01L23/48 ,  H01L23/495

Abstract: A SEMICONDUCTOR MODULE INCLUDES A SEMICONDUCTOR CHIP, A LEAD FRAME HAVING LEAD FINGERS, AND A DOWN SET MEMBER WITHIN AN ENCAPSULANT FOR REDUCE WARPAGE AND PROVIDING A MORE PLANAR PACKAGE BY BALANCING THERMAL STRESS BETWEEN THE LEAD FINGERS AND THE ENCAPSULANT. THE DOWN SET MEMBER CAN BE A BENT PORTION OF THE LEAD FRAME. IT CAN ALSO BE A SEPARATE BODY, SUCH AS A DUMMY SEMICONDUCTOR CHIP.

公开(公告)号：HK1042591A1

公开(公告)日：2002-08-16

申请号：HK02104209

申请日：2002-06-03

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.