公开(公告)号：US3617411A

公开(公告)日：1971-11-02

申请号：US3617411D

申请日：1969-01-14

Applicant: IBM

Inventor： COUTURE ROGER A ,  LAJZA JOHN J JR ,  WRIGHT WILLIAM E

IPC: C23C22/00 ,  G03F7/11 ,  C23B3/00 ,  C23F1/02 ,  C23F7/26

CPC classification number: C23C22/00 ,  G03F7/11 ,  Y10S428/901

Abstract: Very small patterns may be etched in aluminum or other metal surfaces using photoresist to mask areas of the surfaces where etching is not desired by applying a Werner complex of chromium with a carboxylic acid to the metal surface. The process is particularly useful for etching conducting lines in microminiature semiconductor device fabrication because the chromium complex increases the adhesion of the photoresist to the aluminum sufficiently to improve line resolution in subsequent etching, and does not increase bridging between adjacent conducting lines.

公开(公告)号：US3642549A

公开(公告)日：1972-02-15

申请号：US3642549D

申请日：1969-01-15

Applicant: IBM

Inventor： COUTURE ROGER A ,  LAJZA JOHN J JR

IPC: C03C15/00 ,  H01L21/311 ,  C09K3/00 ,  G01N31/22

CPC classification number: C03C15/00 ,  H01L21/31111 ,  Y10T436/108331

Abstract: In the etching through a protective glass coating to expose an underlying metal, overetching is prevented by adding a polyhydric alcohol, for example glycerin, to a glass etchant, which causes a color change on a metal, for example aluminum or molybdenum, indicating that etching through the glass coating has been completed.

Abstract translation: 在通过保护性玻璃涂层进行蚀刻以暴露下面的金属时，通过向玻璃蚀刻剂中加入多元醇（例如甘油）来防止过蚀刻，这导致金属上的颜色变化，例如铝或钼，表明蚀刻 通过玻璃涂层已经完成。

公开(公告)号：US3586554A

公开(公告)日：1971-06-22

申请号：US3586554D

申请日：1969-01-15

Applicant: IBM

Inventor： COUTURE ROGER A ,  GLEASON ROBERT T ,  LAJZA JOHN J JR

IPC: G03F7/075 ,  H01L21/312 ,  H01L7/00

CPC classification number: H01L21/3121 ,  G03F7/0751 ,  Y10S438/948

Abstract: VERY SMALL PATTERNS MAY BE ETCHED IN SILICON DIOXIDE OR OTHER OXIDE SURFACES USING PHOTORESIST TO MASK AREAS OF SURFACES WHERE ETCHING IS NOT DESRIED BY APPLYING A DISILYLAMIDE TO THE SURFACE TO INCREASE THE AHESION OF THE PHOTORESIST. THE PROCESS IS PARTICULARLY USEFUL FOR ETCHING PATTERNS IN SILICON DIOXIDE MASKS USED IN THE FABRICATION OF MICROMINIATURE SEMICONDUCTOR DEVICES.

公开(公告)号：JP2002043494A

公开(公告)日：2002-02-08

申请号：JP2001194587

申请日：2001-06-27

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a method for reducing and eliminating the strain of a plastic package. SOLUTION: A semiconductor module includes a semiconductor chip, a lead frame having a lead finger, and a down set member being in a mounting medium for reducing the strain and giving a flat package by balancing thermal stress between the lead finger and the mounting medium. The down set member may be the bent part of the lead frame. The down set member may be another body such as a dummy semiconductor chip.

公开(公告)号：BR0102606A

公开(公告)日：2002-02-13

申请号：BR0102606

申请日：2001-06-28

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L23/06

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

公开(公告)号：CA2350057A1

公开(公告)日：2001-12-28

申请号：CA2350057

申请日：2001-06-07

Applicant: IBM

Inventor： CALETKA DAVID V ,  LAJZA JOHN J JR ,  IRISH GARY H ,  CARPER JAMES L ,  RAMSEY CHARLES R ,  VADNAIS MICHAEL J ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  OSBORNE GORDON C JR ,  SMITH ROBERT M

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L23/02

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having le ad fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.

公开(公告)号：CA1123121A

公开(公告)日：1982-05-04

申请号：CA337524

申请日：1979-10-12

Applicant: IBM

Inventor： DREVES RICHARD F ,  FRESIA JOHN F ,  KIM SANG U ,  LAJZA JOHN J JR

IPC: H01L21/033 ,  H01L21/22 ,  H01L21/28 ,  H01L21/331 ,  H01L21/338 ,  H01L29/47 ,  H01L29/73 ,  H01L29/872

Abstract: Self Aligned Schottky Guard Ring A method of forming a self aligned guard ring surrounding a schottky barrier diode device without requiring an enlargement of the final schottky barrier device. The method involves creating an overhanging opening in a insulator layer overlying a semiconductor body to expose the schottky contact area on the surface of the semiconductor body, depositing a diffusion barrier material such as molybdenum in the opening, the deposit being of the same size as the smallest part of the overhanging opening so that a guard ring can be formed from a vapor by diffusion around the deposited barrier material.

公开(公告)号：MY119889A

公开(公告)日：2005-07-29

申请号：MYPI20012927

申请日：2001-06-21

Applicant: IBM

Inventor： CALETKA DAVID V ,  VADNAIS MICHAEL J ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M

IPC: H01L23/28 ,  H01L23/50 ,  H01L21/56 ,  H01L23/02 ,  H01L23/16 ,  H01L23/38 ,  H01L23/48 ,  H01L23/495

Abstract: A SEMICONDUCTOR MODULE INCLUDES A SEMICONDUCTOR CHIP, A LEAD FRAME HAVING LEAD FINGERS, AND A DOWN SET MEMBER WITHIN AN ENCAPSULANT FOR REDUCE WARPAGE AND PROVIDING A MORE PLANAR PACKAGE BY BALANCING THERMAL STRESS BETWEEN THE LEAD FINGERS AND THE ENCAPSULANT. THE DOWN SET MEMBER CAN BE A BENT PORTION OF THE LEAD FRAME. IT CAN ALSO BE A SEPARATE BODY, SUCH AS A DUMMY SEMICONDUCTOR CHIP.

公开(公告)号：HK1042591A1

公开(公告)日：2002-08-16

申请号：HK02104209

申请日：2002-06-03

Applicant: IBM

Inventor： CALETKA DAVID V ,  CARPER JAMES L ,  CINCOTTA JOHN P ,  HORSFORD KIBBY B ,  IRISH GARY H ,  LAJZA JOHN J JR ,  OSBORNE GORDON C JR ,  RAMSEY CHARLES R ,  SMITH ROBERT M ,  VADNAIS MICHAEL J

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/16 ,  H01L23/495 ,  H01L23/50 ,  H01L

Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.