公开(公告)号：JPH05218608A

公开(公告)日：1993-08-27

申请号：JP21676992

申请日：1992-08-14

Applicant: IBM

Inventor： KURAUDEIUSU FUIIGAA ,  TERESHITA OODOONZU GURAHAMU ,  KAATO RUDORUFU GURIIBU ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  JIYON JIYOZEFU RIUTOKASU ,  RINDA KIYARORAIN MASHIYUU ,  MAIKERU JIYON PAAMAA ,  NERUSON RATSUSERU TANAA ,  HOO MIN TON ,  CHIYAARUZU HAIRE UIRUSON ,  HEREN RI IEE

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

Abstract: PURPOSE: To provide a method for obtaining a self-aligned protecting coating, so as to cover a gold-plated copper wire in a flex manufacturing process. CONSTITUTION: This method has following steps, wherein a gold layer 14 is plated on a copper lead 13 that is selectively fixed to a polyimide substrate through a seed layer 13A made of e.g. chromium. Thereafter a resist is used on both side first. Then, the resist is exposed on the both sides of the substrate and developed, and a polyimide 15 is etched. Then, a window 16 is formed. After the window has been formed, the resist is further exposed and hardened.