公开(公告)号：JPH0818205A

公开(公告)日：1996-01-19

申请号：JP14186495

申请日：1995-06-08

Applicant: IBM

Inventor： HENRII ATOKINSON NAI ZA SAADO ,  JIEFURII FUREDERITSUKU ROODAA ,  HOO MIN TON ,  POORU ANSONII TOTSUTA

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/485

Abstract: PURPOSE: To allow a CrCu alloy layer to be selectively etched also and improve the yield and reliability of the structure of interconnection solder terminals, by etching a metal adhesive layer. CONSTITUTION: The electroplated solder terminal comprises a lower metal adhesive layer 80, a CrCu intermediate barrier layer 85 on the adhesive layer 80, a soldered joint layer 90 on the CrCu layer 85, and an upper solder layer 120. The adhesive layer 80 is a TiW layer or TiN layer. To manufacture this improved terminal metal, unnecessary regions, such as the soldered joint layer, the intermediate barrier layer and the lower joint layer, are removed from the area outside the solder region, and the soldered joint layer 90, the CrCu intermediate barrier layer 85 and the TiW lower metal adhesive layer 80 are formed. Specifically, after the deposition of TiW, the CrCu layer is deposited from a CrCu alloy target by sputtering, and further a Cu layer is deposited form a Cu target by sputtering. Thereafter, solder is selectively applied to the open positions between substrates to form the solder layer 120, and then etching is performed.

公开(公告)号：JPH05218608A

公开(公告)日：1993-08-27

申请号：JP21676992

申请日：1992-08-14

Applicant: IBM

Inventor： KURAUDEIUSU FUIIGAA ,  TERESHITA OODOONZU GURAHAMU ,  KAATO RUDORUFU GURIIBU ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  JIYON JIYOZEFU RIUTOKASU ,  RINDA KIYARORAIN MASHIYUU ,  MAIKERU JIYON PAAMAA ,  NERUSON RATSUSERU TANAA ,  HOO MIN TON ,  CHIYAARUZU HAIRE UIRUSON ,  HEREN RI IEE

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

Abstract: PURPOSE: To provide a method for obtaining a self-aligned protecting coating, so as to cover a gold-plated copper wire in a flex manufacturing process. CONSTITUTION: This method has following steps, wherein a gold layer 14 is plated on a copper lead 13 that is selectively fixed to a polyimide substrate through a seed layer 13A made of e.g. chromium. Thereafter a resist is used on both side first. Then, the resist is exposed on the both sides of the substrate and developed, and a polyimide 15 is etched. Then, a window 16 is formed. After the window has been formed, the resist is further exposed and hardened.