公开(公告)号：JPS56126989A

公开(公告)日：1981-10-05

申请号：JP16209380

申请日：1980-11-19

Applicant: IBM

Inventor： AABINGU EIMUZU ,  BIRUHERUMU ANATSUKAA ,  KAATO RUDORUFU GURIIBU ,  CHIYAARUZU JIYON KAACHIYAA

IPC: H01L27/18 ,  H01L23/485 ,  H01L23/532 ,  H01L39/02 ,  H01L39/22

公开(公告)号：JPH04230050A

公开(公告)日：1992-08-19

申请号：JP13058791

申请日：1991-05-02

Applicant: IBM

Inventor： MAIKERU FURANKU SHINA ,  MITSUCHIERU SHIMONZU KOOEN ,  EFURAIMU BEMISU FURINTO ,  KAATO RUDORUFU GURIIBU ,  DAGURASU JIYOO HOORU ,  KENESU POORU JIYAKUSON ,  MODESUTO MAIKERU OPURISUKO

IPC: H01L21/30 ,  G02B6/42 ,  H01L21/027 ,  H01L21/68 ,  H01S5/00

Abstract: PURPOSE: To provide a highly accurate passive positioning technique suitable for positioning the several sets of objects, before providing objects on an mounting surface. CONSTITUTION: By optically positioning a reference mark 516 marked on a transparent positioning plate 500, a laser 512 and the reference marks 515 and 517 marked on a fiber carrier 511, the transparent positioning plate 500, the laser 512 and the fiber carrier 511 (one set of objects) are passively positioned. A set of the passively positioned objects are temporarily fixed by a vacuum source 504. Thus, positioning is performed accurately.

公开(公告)号：JPS62260346A

公开(公告)日：1987-11-12

申请号：JP921887

申请日：1987-01-20

Applicant: IBM

Inventor： IFUREIMU BEMISU FURINTO ,  KAATO RUDORUFU GURIIBU ,  PIITAA ARUFURETSUDO GURUUBAA ,  AASAA RICHIYAADO JINGAA

IPC: H01L23/36 ,  H01L23/433 ,  H01L23/467

公开(公告)号：JPS62260347A

公开(公告)日：1987-11-12

申请号：JP4902087

申请日：1987-03-05

Applicant: IBM

Inventor： EKURAIMU BEMISU FURINTO ,  KAATO RUDORUFU GURIIBU

IPC: F28F9/22 ,  H01L23/433 ,  H01L23/473

公开(公告)号：JPH05218608A

公开(公告)日：1993-08-27

申请号：JP21676992

申请日：1992-08-14

Applicant: IBM

Inventor： KURAUDEIUSU FUIIGAA ,  TERESHITA OODOONZU GURAHAMU ,  KAATO RUDORUFU GURIIBU ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  JIYON JIYOZEFU RIUTOKASU ,  RINDA KIYARORAIN MASHIYUU ,  MAIKERU JIYON PAAMAA ,  NERUSON RATSUSERU TANAA ,  HOO MIN TON ,  CHIYAARUZU HAIRE UIRUSON ,  HEREN RI IEE

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

Abstract: PURPOSE: To provide a method for obtaining a self-aligned protecting coating, so as to cover a gold-plated copper wire in a flex manufacturing process. CONSTITUTION: This method has following steps, wherein a gold layer 14 is plated on a copper lead 13 that is selectively fixed to a polyimide substrate through a seed layer 13A made of e.g. chromium. Thereafter a resist is used on both side first. Then, the resist is exposed on the both sides of the substrate and developed, and a polyimide 15 is etched. Then, a window 16 is formed. After the window has been formed, the resist is further exposed and hardened.

公开(公告)号：JPS583238A

公开(公告)日：1983-01-10

申请号：JP1651982

申请日：1982-02-05

Applicant: IBM

Inventor： KAATO RUDORUFU GURIIBU ,  JIEEMUZU MATSUKERU EDOUIN HAAP

IPC: H05K3/34 ,  B23K1/005 ,  B23K1/20 ,  B23K17/00 ,  C23G5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60