公开(公告)号：JP2001242358A

公开(公告)日：2001-09-07

申请号：JP2001000074

申请日：2001-01-04

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide an improved assembly for joining between a horizontal optical fiber cable and a vertical optoelectronic die. SOLUTION: A package is provided in which an optical fiber cable of 12-channel width is joined to a 12-channel vertical resonator type surface emitting laser(VCSEL) transmitter and a multi-channel perpendicularly aligned integrated die(PAID) receiver. According to this package, the height of an assembly package may be lowered by vertically facing a certain die that is parallel to the optical fiber cable and by horizontally facing a certain other die. In this assembly, a vertical optoelectronic die may be vertically connected to a horizontal laminate through a flexible circuit.

公开(公告)号：JPH10224012A

公开(公告)日：1998-08-21

申请号：JP1529898

申请日：1998-01-28

Applicant: IBM

Inventor： MICHAEL AXIAL ,  HALL RICHARD R ,  ROBERT NICHOLAS IVES

IPC: H05K3/22 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To place a flexible substrate to a stiffener with a high stiffness and to avoid a deterioration due to a crack by allowing the pressure-sensitive adhesive surface of the stiffener to oppose the reverse side of a flexible substrate with a solder ball with a space, sending vacuum and fixing the positions of the flexible substrate and the stiffener, and pressurizing an area around the solder ball. SOLUTION: A flexible substrate 10' is formed at a flexible tape with a circuit and a solder ball and is subjected to vacuum support at a specific position. A stiffener 29 has a pressure-sensitive adhesive 30 on a surface that faces the substrate 10'. An auxiliary support body 31 has a compliant block consisting of silicon rubber so that a support force to be given becomes uniform. A ram 34 gives an upward force and moves the stiffener 29 in a form where it faces the surface of the substrate 10' being opposite to the surface with the solder ball, so that the pressure-sensitive adhesive 30 places the stiffener 29 on the substrate l0'. When the stiffener 29 is engaged to the substrate 10' due to the move of the ram 34, the force reaches approximately 2,000 pound per square inch in a certain amount of time.

公开(公告)号：DE10065034B4

公开(公告)日：2006-01-19

申请号：DE10065034

申请日：2000-12-23

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  G02B6/43 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18

Abstract: A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

公开(公告)号：DE10065034A1

公开(公告)日：2001-08-09

申请号：DE10065034

申请日：2000-12-23

Applicant: IBM

Inventor： CHAN BENSON ,  COHEN MITCHELL S ,  FORTIER PAUL F ,  FREITAG LADD W ,  HALL RICHARD R ,  JOHNSON GLEN W ,  LIN HOW TZU ,  SHERMAN JOHN H

IPC: G02B6/44 ,  G02B6/38 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  H01S5/183 ,  H05K1/18 ,  G02B6/26

Abstract: The module is operatively connected to a host card, and includes a laminate for carrying optoelectronic components, an amplifier chip and a flexible circuit for receiving the amplified electrical signals from the amplifier chip. An optoelectronic chip is electrically connected to the flexible circuit and receives the amplified electrical signals generated by the amplifier chip, and produces optical signals in response. Independent claims are included for an optoelectronic sub-module, a compact module article, a transmitting optoelectric sub-module, an electronic compact sub-module, and a method of coupling a fibre-optical cable to a converter chip.