公开(公告)号：SG87156A1

公开(公告)日：2002-03-19

申请号：SG200004528

申请日：2000-08-16

Applicant: IBM

Inventor： KARL E BOGGS ,  KENNETH M DAVIS ,  WILLIAM F LANDERS ,  MICHAEL F LOFARO ,  ADAM D TICKNOR ,  RONALD D FIEGE

IPC: B24B37/30 ,  B24B37/32 ,  B24B49/12 ,  B24B49/16 ,  H01L21/302 ,  H01L21/304

Abstract: A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric actuators. The actuators sense pressure variations across the semiconductor wafer and are individually controllable. A control is connected to the actuators for monitoring sensed pressure variations and controlling the actuators to provide a controlled pressure distribution across the semiconductor wafer.