公开(公告)号：SG99347A1

公开(公告)日：2003-10-27

申请号：SG200100662

申请日：2001-02-06

Applicant: IBM

Inventor： TIMOTHY F CARDEN ,  TODD W DAVIES ,  ROSS WILLIAM KEESLER ,  ROBERT D SEBESTA ,  DAVID B STONE ,  CHERYL L TYTRAN-PALOMAKI

IPC: H01L23/12 ,  H01L23/498 ,  H01R33/76 ,  H01R4/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K3/40 ,  H05K3/36

Abstract: An organic integrated circuit chip carrier for high density integrated circuit chip attach, wherein the contact pads or microvias which provide electrical interconnections to external circuitry are located in a first array pattern, while the plated through holes or through-vias are located in a second array pattern. This allows utilization of wiring channels within the chip carrier in which signal wiring traces can be routed.