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公开(公告)号:WO2011061043A3
公开(公告)日:2011-10-27
申请号:PCT/EP2010066149
申请日:2010-10-26
Applicant: IBM , MOUMEN NAIM , MARTIN YVES , VAN KESSEL THEODORE GERARD , SANDSTROM ROBERT , GUHA SUPRATIK
Inventor: MOUMEN NAIM , MARTIN YVES , VAN KESSEL THEODORE GERARD , SANDSTROM ROBERT , GUHA SUPRATIK
IPC: H01L31/0224 , H01L31/068
CPC classification number: H01L31/1804 , H01L31/02245 , H01L31/0682 , Y02E10/547 , Y02P70/521
Abstract: Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
Abstract translation: 到光伏电池正面的电接触由导电的直通基板通孔阵列提供,并且可选地,位于光伏电池正面上的导电块阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电的贯穿衬底通孔的连续区域,同时暴露光伏电池的背面的一部分。 导电材料层被沉积在光伏电池的后表面上,并且被图案化以形成第一导电布线结构,其电连接导电贯穿基板通孔和第二导电布线结构,该第二导电布线结构提供到光伏电池的后侧的电连接 细胞。
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公开(公告)号:GB2487881B
公开(公告)日:2013-10-16
申请号:GB201209027
申请日:2010-10-18
Applicant: IBM
Inventor: GUHA SUPRATIK , MARTIN YVES , SANDSTROM ROBERT , KESSEL THEODORE GERARD VAN
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公开(公告)号:GB2488421B
公开(公告)日:2013-11-20
申请号:GB201202928
申请日:2010-10-26
Applicant: IBM
Inventor: MOUMEN NAIM , MARTIN YVES , KESSEL THEODORE GERARD VAN , SANDSTROM ROBERT , GUHA SUPRATIK
IPC: H01L31/0224 , H01L31/0687
Abstract: Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
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公开(公告)号:GB2488421A
公开(公告)日:2012-08-29
申请号:GB201202928
申请日:2010-10-26
Applicant: IBM
Inventor: MOUMEN NAIM , MARTIN YVES , KESSEL THEODORE GERARD VAN , SANDSTROM ROBERT , GUHA SUPRATIK
IPC: H01L31/0224 , H01L31/0687
Abstract: Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.
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公开(公告)号:GB2487881A
公开(公告)日:2012-08-08
申请号:GB201209027
申请日:2010-10-18
Applicant: IBM
Inventor: GUHA SUPRATIK , MARTIN YVES , SANDSTROM ROBERT , KESSEL THEODORE GERARD VAN
IPC: G01J1/42
Abstract: Techniques for analyzing performance of solar panels and/or cells are provided. In one aspect, a method for analyzing an infrared thermal image taken using an infrared camera is provided. The method includes the following steps. The infrared thermal image is converted to temperature data. Individual elements are isolated in the infrared thermal image. The temperature data for each isolated element is tabulated. A performance status of each isolated element is determined based on the tabulated temperature data. The individual elements can include solar panels and/or solar cells. In another aspect, an infrared diagnostic system is provided. The infrared diagnostic system includes an infrared camera which can be remotely positioned relative to one or more elements to be imaged; and a computer configured to receive thermal images from the infrared camera, via a communication link, and analyze the thermal images.
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