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    Heat exchanger for semiconductor
    3.
    发明专利
    Heat exchanger for semiconductor 有权
    半导体热交换器

    公开(公告)号：JP2006203159A

    公开(公告)日：2006-08-03

    申请号：JP2005263863

    申请日：2005-09-12

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： MARTIN YVES ,  KESSEL THEODORE G V

    IPC: H01L23/427 ,  F25D9/00

    CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a heat exchanger capable of improving a heat transmission between a chip and a heat sink.
    SOLUTION: This invention relates to a method and an apparatus for cooling a heat source. In one practical embodiment a heat exchanger 100 is provided. This includes a passage 114 for receiving cooling liquid 112 which is provided with a first front surface 106 and a facing second front surface 104. In the passage 114 there is arranged a mesh plug 110 by which the cooling liquid 112 is mixed so as to generate a turbulent flow in the passage 114. The first front surface 106 of the passage 114 is arranged adjacent to a semiconductor heat source 102. In the one practical embodiment the first front surface 106 includes plastic. In the one practical embodiment the second front surface 104 includes a metal like copper for example. In the one practical embodiment the mesh plug 110 includes a copper mesh covered with nickel.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：提供能够改善芯片和散热器之间的热传递的热交换器。 解决方案：本发明涉及一种冷却热源的方法和装置。 在一个实际的实施例中，提供了热交换器100。 这包括用于接收冷却液体112的通道114，冷却液体112设置有第一前表面106和相对的第二前表面104.在通道114中布置有网孔110，冷却液112通过该网孔混合以产生 通道114中的湍流。通道114的第一前表面106布置成与半导体热源102相邻。在一个实际实施例中，第一前表面106包括塑料。 在一个实际的实施例中，第二前表面104例如包括类似铜的金属。 在一个实际的实施例中，网孔110包括覆盖有镍的铜网。 版权所有（C）2006，JPO＆NCIPI

    Air/fluid cooling system
    4.
    发明专利
    Air/fluid cooling system 有权
    空气/流体冷却系统

    公开(公告)号：JP2008124458A

    公开(公告)日：2008-05-29

    申请号：JP2007278464

    申请日：2007-10-26

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： MARTIN YVES ,  VAN KESSEL THEODORE G

    IPC: H01L23/473 ,  H01L23/36 ,  H05K7/20

    CPC classification number: H01L23/427 ,  F28D15/0233 ,  F28F1/02 ,  F28F3/048 ,  F28F9/0275 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To allow access to a cooling system for maintenance, repair, upgrade, or the like. SOLUTION: In one embodiment, a device for dispersing the heat from a heat generating device comprises a base that has a first side surface so constituted as to thermally couple with the heat generating device, a cooling channel of air-base which is coupled with the base for dispersing at least a part of the heat through air, and a cooling channel of fluid-base which is coupled with the base for dispersing at least a part of the heat through a fluid. The cooling channel of air-base and the cooling channel of fluid-base operate simultaneously or independently, to disperse heat from the heat generating device. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：允许访问冷却系统进行维护，修理，升级等。 解决方案：在一个实施例中，用于分散来自发热装置的热量的装置包括：基座，其具有构造成与发热装置热耦合的第一侧表面，空气基底的冷却通道 与用于通过空气散发至少一部分热量的底座相耦合，以及流体底座的冷却通道，该冷却通道与基座联接，用于通过流体分散至少一部分热量。 空气基座的冷却通道和流体基座的冷却通道同时或独立地工作，以分散来自发热装置的热量。 版权所有（C）2008，JPO＆INPIT

    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL
    5.
    发明申请
    GRID-LINE-FREE CONTACT FOR A PHOTOVOLTAIC CELL 审中-公开
    用于光伏电池的无网格接触

    公开(公告)号：WO2011061043A3

    公开(公告)日：2011-10-27

    申请号：PCT/EP2010066149

    申请日：2010-10-26

    Applicant: IBM ,  MOUMEN NAIM ,  MARTIN YVES ,  VAN KESSEL THEODORE GERARD ,  SANDSTROM ROBERT ,  GUHA SUPRATIK

    Inventor： MOUMEN NAIM ,  MARTIN YVES ,  VAN KESSEL THEODORE GERARD ,  SANDSTROM ROBERT ,  GUHA SUPRATIK

    IPC: H01L31/0224 ,  H01L31/068

    CPC classification number: H01L31/1804 ,  H01L31/02245 ,  H01L31/0682 ,  Y02E10/547 ,  Y02P70/521

    Abstract: Electrical contact to the front side of a photovoltaic cell is provided by an array of conductive through-substrate vias, and optionally, an array of conductive blocks located on the front side of the photovoltaic cell. A dielectric liner provides electrical isolation of each conductive through-substrate via from the semiconductor material of the photovoltaic cell. A dielectric layer on the backside of the photovoltaic cell is patterned to cover a contiguous region including all of the conductive through-substrate vias, while exposing a portion of the backside of the photovoltaic cell. A conductive material layer is deposited on the back surface of the photovoltaic cell, and is patterned to form a first conductive wiring structure that electrically connects the conductive through-substrate vias and a second conductive wiring structure that provides electrical connection to the backside of the photovoltaic cell.

    Abstract translation: 到光伏电池正面的电接触由导电的直通基板通孔阵列提供，并且可选地，位于光伏电池正面上的导电块阵列提供。 电介质衬垫提供每个导电贯穿衬底通孔与光伏电池的半导体材料的电隔离。 在光伏电池的背面上的电介质层被图案化以覆盖包括所有导电的贯穿衬底通孔的连续区域，同时暴露光伏电池的背面的一部分。 导电材料层被沉积在光伏电池的后表面上，并且被图案化以形成第一导电布线结构，其电连接导电贯穿基板通孔和第二导电布线结构，该第二导电布线结构提供到光伏电池的后侧的电连接 细胞。

    10.
    发明专利
    未知

    公开(公告)号：AT399336T

    公开(公告)日：2008-07-15

    申请号：AT05804583

    申请日：2005-10-18

    Applicant: IBM

    Inventor： COLBURN MATTHEW ,  MARTIN YVES ,  RETTNER CHARLES ,  VAN KESSEL THEODORE ,  WICKRAMASINGHE HEMATHA

    IPC: G03F7/00

    Abstract: A method (and resultant structure) of forming a plurality of masks, includes creating a reference template, using imprint lithography to print at least one reference template alignment mark on all of a plurality of mask blanks for a given chip set, and printing sub-patterns on each of the plurality of mask blanks, and aligning the sub-patterns to the at least one reference template alignment mark.

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