公开(公告)号：DE3365839D1

公开(公告)日：1986-10-09

申请号：DE3365839

申请日：1983-05-27

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： BAYER THOMAS ,  HINKEL HOLGER DR DIPL PHYS ,  KLEISCHMANN KURT ,  KUNZEL ULRICH DR DIPL CHEM ,  SCHAFER ROLF DR

IPC: G11B5/70 ,  G11B5/66 ,  G11B5/73 ,  G11B5/733 ,  G11B5/82 ,  H01F10/30

Abstract: The invention relates to a composite magnetic disk for magnetic recording, which consists of an annular core of polymeric material to which is bonded at least one disk of reaction-bonded silicon carbide with a magnetic recording layer on its outer surface. After its processing, the SiSiC disk surface shows optimum planarity and smoothness so that it can be used as a magnetic disk substrate. Furthermore, the material has a low density and an extremely high specific modulus of elasticity so that numbers of revolution higher than obtainable with formerly known AlMg5 disk substrates can be reached.

公开(公告)号：DE3376186D1

公开(公告)日：1988-05-05

申请号：DE3376186

申请日：1983-08-02

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： DRUSCHKE FRANK DR DIPL CHEM ,  KRAUS GEORG ,  KUNZEL ULRICH DR DIPL CHEM ,  RUH WOLF-DIETER DIPL ING ,  SCHAFER ROLF DR

IPC: C23F4/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/3213 ,  H05K3/08 ,  C23F1/00 ,  H01L21/31

Abstract: Cpds. (A) contg. at least one CH3- or -CH2- gp. are used for dry-etching Cu in a glow discharge. The Cu can be etched selectively in the presence of polymers, e.g. after partly masking with a polymer layer of esp. a negative or positive lacquer or a polyimide.

公开(公告)号：DE3377454D1

公开(公告)日：1988-08-25

申请号：DE3377454

申请日：1983-09-23

Applicant: IBM DEUTSCHLAND ,  IBM

Inventor： BAYER THOMAS ,  KRAUS GEORG ,  KUNZEL ULRICH DR DIPL CHEM ,  RENZ GISELA ,  SCHAFER ROLF DR

IPC: H05K3/24 ,  C23C14/04 ,  C23C14/14 ,  C23C14/22 ,  C23C14/24 ,  C23C14/34 ,  H01J37/317 ,  H01J37/32 ,  H01L21/28 ,  H01L21/285 ,  H01L21/3205 ,  H05K3/12 ,  H05K3/14 ,  H05K3/10 ,  C23C14/36

Abstract: A metal layer is applied selectively and self-adjustingly on conductive regions on the surface of insulating or semiconductive substrates by positioning a metal plate (3), consisting of one or more layers of material to be applied, facing and at a small spacinq from the conductive regions (2) and then producing Tesla currents between the metal plate (3) and the conductive regions (2). Also claimed are a system for carrying out the process and use of the process for thickening conductive patterns, esp. for prodn. of conductor lines on or in modules of (glass-) ceramic material, circuit boards and semiconductor bodies, of reproductions of metallic structures, for filling holes in insulating layers between two metallisation levels which are electrically interconnected, for contact improving of solder spots, and for repair purposes.

公开(公告)号：DE3068851D1

公开(公告)日：1984-09-13

申请号：DE3068851

申请日：1980-04-18

Applicant: IBM

Inventor： BUHNE JOACHIM ,  FROSCH ALBERT ,  SCHAFER ROLF DR ,  STOFFEL AXEL DR

IPC: C25F3/12 ,  C25F3/14 ,  H01L21/306 ,  H01L21/3063