公开(公告)号：IT1150984B

公开(公告)日：1986-12-17

申请号：IT2072480

申请日：1980-03-18

Applicant: IBM

Inventor： BUHNE JOACHIM ,  SCHAFER ROLF ,  STOFFEL AXEL

IPC: C25F3/12 ,  C25F3/14 ,  H01L21/3063 ,  C25F

Abstract: An apparatus and method for selectively electrochemically etching a surface is described. The use of the apparatus and the related method allows the establishment of etched planar surface which may be inclined with respect to the original surface. The apparatus has a cathode and multiple connectors which attach to the workpiece whose surface is to be etched. When the apparatus is operated the potential of the connectors are set so that the cathode is at least as negative as the lowest potential of the connectors.

公开(公告)号：DE3068851D1

公开(公告)日：1984-09-13

申请号：DE3068851

申请日：1980-04-18

Applicant: IBM

Inventor： BUHNE JOACHIM ,  FROSCH ALBERT ,  SCHAFER ROLF DR ,  STOFFEL AXEL DR

IPC: C25F3/12 ,  C25F3/14 ,  H01L21/306 ,  H01L21/3063