1.
    发明专利
    未知

    公开(公告)号:DE3381648D1

    公开(公告)日:1990-07-19

    申请号:DE3381648

    申请日:1983-10-11

    Applicant: IBM

    Abstract: Apparatus and method for determining the initiation, progress, and quality of electroless plating of blind or through-hole walls in circuit panels. A test coupon (10) for monitoring the plating is provided having a sensitized initiation conductivity zone (23) and sensitized through-hole (13) walls arranged in a series resistance circuit (12, 14, 15, 16). Both conductivity zone and series circuit are measured periodically as to resistivity to determine the start of electroless plating and its progress during continued immersion of the panels in the plating bath.

    2.
    发明专利
    未知

    公开(公告)号:DE3766031D1

    公开(公告)日:1990-12-13

    申请号:DE3766031

    申请日:1987-07-24

    Applicant: IBM

    Abstract: Method of controlling the residual resistivity of an electrolessly deposited metal by first, determining the mathematical relationship between the residual resistivity of the deposited metal and its rate of deposition and second, depositing said metal at a rate to produce a predetermined residual resistivity.

    3.
    发明专利
    未知

    公开(公告)号:DE3584233D1

    公开(公告)日:1991-10-31

    申请号:DE3584233

    申请日:1985-10-17

    Applicant: IBM

    Abstract: The quantity of an anionic material in a sample is determined by adjusting the pH of the sample to place the material in nonionic extractable form, extracting out the material, spectrophotometrically measuring the extracted material, and comparing the measured value to a standard in order to determine the quantity of the anionic material.

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