公开(公告)号：DE69716560D1

公开(公告)日：2002-11-28

申请号：DE69716560

申请日：1997-08-22

Applicant: IBM

Inventor： BASSI LUIGI ,  SPINZI PAOLO

IPC: B08B1/04 ,  B08B5/02

公开(公告)号：GB2336122A

公开(公告)日：1999-10-13

申请号：GB9807407

申请日：1998-04-08

Applicant: IBM

Inventor： BASSI LUIGI ,  MONOPOLI MICHELE ,  SPINZI PAOLO ,  VILLA DANILO

IPC: B23K1/018 ,  H05K3/34

Abstract: In a method for reworking a Ball Grid Array electronic module 201, 203, 205, by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the melting point. Then a rotating brush 241, with the rotating axis perpendicular to the substrate plan, removes the solder balls and the solder material particles while the module is still immersed in the fluid.

公开(公告)号：GB2319888A

公开(公告)日：1998-06-03

申请号：GB9625025

申请日：1996-11-30

Applicant: IBM

Inventor： BASSI LUIGI ,  SPINZI PAOLO

IPC: B08B1/04 ,  H01L21/00

Abstract: A brushing system for removing unwanted particles from a substrate surface provides an epicycloidal movement of the brush 201 on the substrate. The system comprises a rotatable shaft 203 with an eccentric bore. The hub 202 of the brush can freely move inside the bore. When the shaft is rotated by a motor 204 and the brush bristles are subject to friction by engaging the substrate, the brush describes an epicycloidal movement.