公开(公告)号：GB2344690A

公开(公告)日：2000-06-14

申请号：GB9826937

申请日：1998-12-09

Applicant: IBM

Inventor： BASSI LUIGI ,  OGGIONI STEFANO

IPC: H01L21/58 ,  H01L23/13

Abstract: A Plastic Ball Grid Array electronic package of the Cavity Down type particulary for use in high-frequency applications. In these packages the substrate has a cavity for receiving an active device (chip), which is usually attached to the substrate by means of the layer of glue. Due to the small dimensions of the chip and the gap between the chip and the cavity walls, it is extremely difficult to control the right quantity of glue in the dispensing operations. When the chip is pressed against the bottom of the cavity the glue may overflow and damage the circuits. According to the present invention, a secondary cavity is created inside the primary one and acts as a reservoir for the glue in excess.

公开(公告)号：GB2319888A

公开(公告)日：1998-06-03

申请号：GB9625025

申请日：1996-11-30

Applicant: IBM

Inventor： BASSI LUIGI ,  SPINZI PAOLO

IPC: B08B1/04 ,  H01L21/00

Abstract: A brushing system for removing unwanted particles from a substrate surface provides an epicycloidal movement of the brush 201 on the substrate. The system comprises a rotatable shaft 203 with an eccentric bore. The hub 202 of the brush can freely move inside the bore. When the shaft is rotated by a motor 204 and the brush bristles are subject to friction by engaging the substrate, the brush describes an epicycloidal movement.

公开(公告)号：DE69716560D1

公开(公告)日：2002-11-28

申请号：DE69716560

申请日：1997-08-22

Applicant: IBM

Inventor： BASSI LUIGI ,  SPINZI PAOLO

IPC: B08B1/04 ,  B08B5/02

公开(公告)号：GB2336122A

公开(公告)日：1999-10-13

申请号：GB9807407

申请日：1998-04-08

Applicant: IBM

Inventor： BASSI LUIGI ,  MONOPOLI MICHELE ,  SPINZI PAOLO ,  VILLA DANILO

IPC: B23K1/018 ,  H05K3/34

Abstract: In a method for reworking a Ball Grid Array electronic module 201, 203, 205, by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the melting point. Then a rotating brush 241, with the rotating axis perpendicular to the substrate plan, removes the solder balls and the solder material particles while the module is still immersed in the fluid.