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公开(公告)号：GB2336122A
公开(公告)日：1999-10-13
申请号：GB9807407
申请日：1998-04-08
Applicant: IBM
Inventor： BASSI LUIGI , MONOPOLI MICHELE , SPINZI PAOLO , VILLA DANILO
Abstract: In a method for reworking a Ball Grid Array electronic module 201, 203, 205, by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the melting point. Then a rotating brush 241, with the rotating axis perpendicular to the substrate plan, removes the solder balls and the solder material particles while the module is still immersed in the fluid.
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