公开(公告)号：US3672744A

公开(公告)日：1972-06-27

申请号：US3672744D

申请日：1970-10-06

Applicant: IBM

Inventor： STROPE DOUGLAS H ,  WILSON ALAN D

IPC: G03H1/02 ,  G02B27/00

CPC classification number: G03H1/0486 ,  G03H1/02 ,  G03H2001/0232 ,  G03H2001/186 ,  G03H2210/62 ,  G03H2260/16 ,  Y10S359/90

Abstract: A SYSTEM AND METHOD FOR HOLOGRAPHY IN WHICH THE RECORDING MEDIUM IS EXPOSED AND VIEWED IMMERSED IN A LIQUID WHICH IS EFFECTIVE TO RELIEVE THE RESIDUAL STRESSES IN THE MEDIUM.

公开(公告)号：CA1293605C

公开(公告)日：1991-12-31

申请号：CA533598

申请日：1987-04-01

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  MARKOVICH VOYA ,  MCCARTHY WILLIAM J ,  MORING ALLEN F ,  MOSCHAK PETER A ,  STROPE DOUGLAS H

IPC: C08J5/24 ,  B29B13/02 ,  B29B13/06 ,  B29B15/08 ,  B29C70/06 ,  B29C71/00 ,  B29K63/00 ,  B29K105/06 ,  B29L9/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

Abstract: EN985-039 PROCESS FOR TREATING REINFORCED POLYMER COMPOSITE Reinforced synthetic polymer composite is treated by heating at a temperature and for a time sufficient to obtain a moisture content below that for the relative humidity level at which the composite is to be drilled and/or photoresist exposed; and then subjecting it to conditions to increase the moisture content to that for the relative humidity level of the drilling.

公开(公告)号：DE3578267D1

公开(公告)日：1990-07-19

申请号：DE3578267

申请日：1985-02-01

Applicant: IBM

Inventor： ENGEL PETER A ,  STROPE DOUGLAS H ,  WRAY THOMAS E

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/02 ,  H01L23/057 ,  H01L23/10 ,  H01L23/16 ,  H01L23/42

Abstract: A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape (50), is disposed between an epoxy composition (30) and the back surface of a substrate (12) and between the epoxy composition and the inner surface of a cap (20) for blocking the movement of the epoxy composition into a gap area (34) during the manufacture of the module. An electronic module comprises a substrate (12), and integrated circuit chip (10) disposed on the substrate, a cap (20) disposed over and enclosing the chip and the substrate, a heat dissipator (26A) disposed between the cap and the chip for carrying away the heat dissipated by the chip, and an epoxy composition (30) secured to the back surface of the substrate for sealing the module, and specifically, the chip within the module from harmful external influences. The boundary of a gap (34) is defined by the edge of the substrate and the inner surface (20B) of the cap. A blocking article, such as a polyimide tape (50), is disposed between the epoxy composition on one side and the back side of the substrate coupled with the inner surface of the cap on the other side for holding the epoxy composition external to the gap and preventing the epoxy composition from being disposed within the gap during the manufacture of the module. As a result, the cap is relatively free to move with respect to the substrate. Unnecessary distortion of the cap is minimized and resultant damage of the chips within the cap is avoided.