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    PICTURE DISPLAY METHOD AND DEVICE IN LIQUID CRYSTAL DISPLAY
    4.
    发明专利
    PICTURE DISPLAY METHOD AND DEVICE IN LIQUID CRYSTAL DISPLAY 失效

    公开(公告)号：JPH11109921A

    公开(公告)日：1999-04-23

    申请号：JP24881897

    申请日：1997-09-12

    Applicant: IBM

    Inventor： MIWA KOICHI ,  SUEOKA KUNIAKI ,  NAKAMURA HAJIME

    IPC: G02F1/133 ,  G09G3/20 ,  G09G3/34 ,  G09G3/36

    Abstract: PROBLEM TO BE SOLVED: To reduce blurred picture in animated picture display and to obtain a satisfactory picture quality free from ghost. SOLUTION: This liquid crystal display device is provided with a control means which, in one period in a cycle of displaying one picture, controls a gate line driving means 2 so as to select a gate line for each of the first and the second pixel array for the purpose of displaying a picture on a liquid crystal panel; which controls the first and the second data line driving means 4a, 4b so that a picture signal for showing a picture is supplied to the first and the second data line group; which, in a separate period different from one in the same cycle as the one period, controls the gate line driving means 2 so as to select the gate line once more for each of the first and the second pixel array; and which controls the first and the second data line driving means 4a, 4b so that a non-picture signal having a prescribed electric potential and different from the picture signal is supplied to the first and the second data line group.

    Semiconductor bonding device
    5.
    发明专利
    Semiconductor bonding device 有权
    半导体接合器件

    公开(公告)号：JP2012216616A

    公开(公告)日：2012-11-08

    申请号：JP2011079874

    申请日：2011-03-31

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： SUEOKA KUNIAKI

    IPC: H01L21/60

    CPC classification number: B23K3/0471 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/755 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor bonding device capable of alleviating stress and performing solder bump connection of a thin silicon chip to a substrate.SOLUTION: In solder bump connection between a contact on a silicon chip having a thickness of 50 μm or less and a plurality of contacts on a substrate, a tool head to which a PGS (Pyrolytic Graphite Sheet) having a thickness of 75-125 μm is adhered is used to form an electrical mechanical bonding by heating and melting and gradual heating based on forced convection of air.

    Abstract translation: 要解决的问题：提供一种能够减轻应力并实现薄硅芯片与衬底的焊料凸点连接的半导体接合装置。 解决方案：在厚度为50μm以下的硅芯片上的触点与基板上的多个触点之间的焊料凸块连接中，具有厚度为75的PGS（热解石墨片）的工具头 -125μm粘合用于通过加热和熔融形成电气机械结合，并且基于空气的强制对流逐渐加热。 版权所有（C）2013，JPO＆INPIT

    DRIVING METHOD FOR LIQUID CRYSTAL DISPLAY DEVICE
    6.
    发明专利
    DRIVING METHOD FOR LIQUID CRYSTAL DISPLAY DEVICE 失效

    公开(公告)号：JPH09185037A

    公开(公告)日：1997-07-15

    申请号：JP33457995

    申请日：1995-12-22

    Applicant: IBM

    Inventor： NAKAMURA HAJIME ,  KIMURA YASUHIRO ,  SUEOKA KUNIAKI ,  TAIRA YOICHI ,  UCHIDA TATSUO

    IPC: G02F1/137 ,  G02F1/133 ,  G02F1/139 ,  G09G3/36

    Abstract: PROBLEM TO BE SOLVED: To shift an OCB cell from a spray orientation state to a bend orientation state in a short time by applying a voltage which is higher than an electric field needed to continue bend orientation between a display electrode (pixel electrode) and a common electrode. SOLUTION: When the power source is turned on, a power-on reset signal is outputted for t1 seconds, and a gate pulse which is about 20-20V similar to an ordinary gate pulse, but has a period much wider than that in ordinary gate timing is outputted to a gate line in the t1 seconds. The gate-on time of this driving method is set long to several msec - several sec. Consequently, the bend orientation as a nucleus is formed between the gate electrode and common electrode. Further, the whole pixel shifts to the bend orientation with the electric field applied between the display electrode and common electrode. As a higher and higher voltage is applied between the display electrode and common electrode, the shift to the bend orientation is faster and faster.

    DEVICE AND METHOD OF OBSERVING MAGNETIC FIELD
    8.
    发明专利
    DEVICE AND METHOD OF OBSERVING MAGNETIC FIELD 失效

    公开(公告)号：JPH04116401A

    公开(公告)日：1992-04-16

    申请号：JP23343890

    申请日：1990-09-05

    Applicant: IBM

    Inventor： WATANUKI MASAAKI ,  SAI FUMINORI ,  SUEOKA KUNIAKI

    IPC: G01B7/34 ,  G01N37/00 ,  G01Q60/10 ,  G01Q60/16 ,  G01Q60/50 ,  G01Q90/00 ,  G01R33/02 ,  G01R33/038 ,  G01R33/10 ,  G01R33/12 ,  H01J37/28

    Abstract: PURPOSE: To observe a magnetic field in the vicinity of the surface of a sample in scanning tunnel michroscopic mode by providing means for extracting the specific frequency component of a tunneling current generated through interaction of the magnetic field and magnetic moment. CONSTITUTION: The magnetic field observing system comprises a cantilever 16, a chip 12 supported on a cantilever 16 and having a magnetic moment at least at the forward end thereof, and means for applying a voltage between the chip 12 and the surface of a sample. The system further comprises means for keeping a distance between the chip 12 and the surface of a sample at a level permitting a tunnel current flow, and means for extracting a specific frequency component of a tunnel current generated through interaction of a magnetic field connected electrically with the chip 12 and the magnetic moment. While keeping the distance between the chip 12 and the surface of the sample at a level permitting a tunnel current flow, a magnetic field alternating at a specific frequency is generated and the chip 12 is oscillated through interaction of the magnetic moment and the magnetic field. Finaly, the specific frequency component of the tunnel current is extracted.

    Creation of combination of studs used for high-precision alignment between multiple chips
    9.
    发明专利
    Creation of combination of studs used for high-precision alignment between multiple chips 审中-公开
    创建用于多个CHIPS之间的高精度对齐的项目组合

    公开(公告)号：JP2013115135A

    公开(公告)日：2013-06-10

    申请号：JP2011258013

    申请日：2011-11-25

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation

    Inventor： SAKUMA KATSUYUKI ,  TORIYAMA KAZUSHIGE ,  SUEOKA KUNIAKI ,  OBARA SAYURI

    IPC: H01L21/60

    CPC classification number: H01L24/81 ,  H01L2924/15787 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To realize high-precision alignment expected between a plurality of chips or between a substrate and chips.SOLUTION: A combination of a plurality of studs is created for regulating relative movement of a plurality of chips in a lateral direction in the case where a solder bump is melted between the plurality of chips. For each of the plurality of chips, the combination of the plurality of studs having a predetermined width is created at a position where any solder bump is defined as a reference in the arrangement of a plurality of solder bumps disposed between the plurality of chips in accordance with a pitch of the plurality of solder bumps in such a manner that the plurality of solder bumps set to each of the plurality of chips are aligned within a predetermined range by regulating the relative movement of the plurality of chips even in the case where the plurality of chips are moved relatively to each other by melting of the plurality of solder bumps.

    Abstract translation: 要解决的问题：实现在多个芯片之间或在基板和芯片之间预期的高精度对准。 解决方案：在多个芯片之间熔化焊料凸块的情况下，产生多个螺柱的组合以调节多个芯片在横向方向上的相对运动。 对于多个芯片中的每一个，在具有预定宽度的多个螺柱的组合中产生一个位置，在这样一个位置处，在根据设置在多个芯片之间的多个焊料凸块的布置中将焊料凸点定义为基准 以多个焊料凸块的间距，使得设置为多个芯片中的每一个的多个焊料凸块通过调节多个芯片的相对移动而在预定范围内对准，即使在多个芯片中的多个 芯片通过多个焊料凸块的熔化相对移动。 版权所有（C）2013，JPO＆INPIT

    Optical element and color display device using the same
    10.
    发明专利
    Optical element and color display device using the same 有权
    光学元件和使用该光学元件的彩色显示装置

    公开(公告)号：JP2005181691A

    公开(公告)日：2005-07-07

    申请号：JP2003422592

    申请日：2003-12-19

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： NUMATA HIDETOSHI ,  TAIRA YOICHI ,  SUEOKA KUNIAKI

    IPC: G02B5/02 ,  G02F1/1335 ,  G02F1/13357

    CPC classification number: G02F1/133524 ,  Y10S385/901

    Abstract: PROBLEM TO BE SOLVED: To provide an optical element and a color display device by which the performance of luminance and a viewing angle are improved and the performance of chromaticity also can be improved by performing the correction of the viewing angle and the emphasis of front luminance or the emphasis of a degree of diffusion.
    SOLUTION: The optical element which is a film-like optical element for correcting the angle of light to a prescribed direction is constituted of two materials 20, 21 between which a difference of refractive indexes is at least 0.1. One material 20 constitutes a plurality of light guides causing total reflection on a boundary with the other adjacent material 21, these light guides 22 are formed so as not to be arrayed at equal intervals or so as to have respectively different cross-sectional areas and the ratio of the width or diameter of an incident part of each light guide to the film thickness of the optical element 15 is at least 1:10.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种光学元件和彩色显示装置，通过该光学元件和彩色显示装置，通过执行视角和强调的校正，可以提高亮度和视角的性能并且还可以提高色度的性能 的前景亮度或强度的一个扩散程度。 解决方案：作为用于将光的角度校正到规定方向的膜状光学元件的光学元件由折射率差为0.1以下的两种材料20,21构成。 一个材料20构成多个导光体，在与另一个相邻材料21的边界上进行全反射，这些光导22形成为不以相等的间隔排列或者分别具有不同的横截面积，并且 每个光导入射部分的宽度或直径与光学元件15的膜厚之比至少为1:10。 版权所有（C）2005，JPO＆NCIPI

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