公开(公告)号：US3573455A

公开(公告)日：1971-04-06

申请号：US3573455D

申请日：1968-09-13

Applicant: IBM

Inventor： SUIERVELD JOHN

IPC: G01B15/00 ,  G01B15/06 ,  G01N23/04 ,  H01L21/68 ,  H05K3/46

CPC classification number: G01N23/04

Abstract: Superimposed X-ray photographs of a partly and/or completely formed laminar printed circuit article, taken before and after a given stage of an article lamination process, are viewed and/or photographed through magnifying optics. Otherwise undetectable dimensional shifts in the article are revealed in this manner at an early stage of manufacture. The problems of assuring precise spatial orientation of the article during the x-ray photography, and of providing an accurate frame of reference for registration of the superimposed photographs, are solved. A special fixture and template are provided for this purpose. The template and article are separately photographed on each film by a double exposure technique. Template and article are separately fixed in orientation relative to the x-ray film by means of the special fixture. The template exposure image constitutes the desired frame of reference for registration of superimposed photograph transparencies. Locating pins on the fixture mate with holes on the template for one x-ray exposure and holes on the article for a second x-ray exposure. The locating pins and the precisely tooled flat surface of the fixture against which the film is held form an absolute frame of reference in three dimensional space.

公开(公告)号：DE3485107D1

公开(公告)日：1991-10-31

申请号：DE3485107

申请日：1984-07-24

Applicant: IBM

Inventor： POWELL JIMMIE L ,  STANDLEY CHARLES L STANDLEY CH ,  SUIERVELD JOHN

IPC: H01L21/306 ,  C03C15/00 ,  H01L21/311 ,  H01L21/768 ,  H05K3/46 ,  H01L21/31 ,  H01L21/60

Abstract: @ A process for forming via openings (60) in a relatively thick layer (50) of borosilicate glass while controlling the degree of taper of the side walls of the opening to be not less than 45° by (1) depositing a layer of silicon nitride that contains silicon in an amount in excess of stoichiometric in Si 3 N 4 (2) densifying the silicon nitride layer, (3) depositing a layer of resist, (4) exposing and developing the layer of resist to define a desired pattern of openings in the borosilicate glass layer, (5) removing the exposed silicon nitride areas, and (6) subjecting the resultant exposed borosilicate glass surface to an etchant for the glass.

公开(公告)号：CA910511A

公开(公告)日：1972-09-19

申请号：CA910511D

Applicant: IBM

Inventor： SUIERVELD JOHN

IPC: G01N23/04

公开(公告)号：DE3366774D1

公开(公告)日：1986-11-13

申请号：DE3366774

申请日：1983-07-13

Applicant: IBM

Inventor： SCHAIBLE PAUL MARTIN ,  SUIERVELD JOHN

IPC: H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

Abstract: A multilevel metallurgy is formed on a dielectric body, particularly a multilayer ceramic (MLC) body (10). The interconnection lines (22) and via studs (26) are formed as an integral structure from a blanket metal layer thus eliminating the interface beween the via pad and via stud. A second level of interconnections (25) can be formed on top of said first interconnection level.

公开(公告)号：DE1945247A1

公开(公告)日：1970-03-19

申请号：DE1945247

申请日：1969-09-06

Applicant: IBM

Inventor： SUIERVELD JOHN

IPC: G01B15/00 ,  G01B15/06 ,  G01N23/04 ,  H01L21/68 ,  H05K3/46

Abstract: 1,237,809. X-ray examination of articles. INTERNATIONAL BUSINESS MACHINES CORP. Aug.29, 1969 [Sept. 13, 1968], No. 43106/69. Heading G1M. [Also in Division H5] A method of examining during manufacture an article such as a laminated printed circuit comprises positioning an X-ray sensitive film 9, Fig. 1, between an X-ray opaque brass template 3 and a steel base 1 by means of locating pins 2, and briefly exposing the film to X-rays 10 through registration holes in the masking plate 3. This is intended to provide registration marks on the film. The film remains unmoved on the base 1 but is then covered by a glass plate instead of the brass plate 3, Fig. 2, and is also covered by exactly registered or positioned but as far unlaminated circuit panels 7 to be inspected for spacing and location of detail features which are then subjected to X-rays 14. The photographed image of the panels 7 is unaffected by the first masked exposure which provided registration marks only, and the film is now developed. The circuit panels are now laminated together and a new film mounted alone under brass plate 3 and given a first or registration marking exposure. The plate 3 is then replaced by the now laminated together panels 8 and the film exposed to X-rays 15, Fig. 3 and then removed. The two films are developed into transparencies and then superimposed in registration on a known light table, Figs. 4-8 (not shown) and examined under a magnifying glass to see if the details of the laminated together or formed circuit laminations as shown on the second transparency are correctly spaced one to another as compared with the originally registered or exactly positioned but unformed laminations shown on the first transparency. In a modification, Fig. 9, the plate 3a is a "picture frame" only bordering the article but permitting X-ray photography of the article and provision of the registration marks to be accomplished in a single step.