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公开(公告)号:DE69006054T2
公开(公告)日:1994-06-30
申请号:DE69006054
申请日:1990-03-05
Applicant: TOSHIBA KAWASAKI KK , IBM
Inventor: TOMII HITOSHI , SUZUKI SHUNJI , NAKANO TETSUYA , TERADA KENJI
IPC: G02F1/13 , G02F1/1339 , G02F1/1341 , G09F9/30
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公开(公告)号:DE69006054D1
公开(公告)日:1994-03-03
申请号:DE69006054
申请日:1990-03-05
Applicant: TOSHIBA KAWASAKI KK , IBM
Inventor: TOMII HITOSHI , SUZUKI SHUNJI , NAKANO TETSUYA , TERADA KENJI
IPC: G02F1/13 , G02F1/1339 , G02F1/1341 , G09F9/30
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公开(公告)号:JP2004335704A
公开(公告)日:2004-11-25
申请号:JP2003129034
申请日:2003-05-07
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor: OSUMI KOICHI , TERADA KENJI , YAMAZAKI KOICHI
CPC classification number: H05K3/427 , H05K3/064 , H05K3/108 , H05K3/4602 , H05K2201/0959 , H05K2203/1394 , Y10T29/49155 , Y10T29/49165
Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-circuit board which can form a via hole having a low aspect ratio and can form a fine line and to provide the printed-circuit board manufactured by this method. SOLUTION: The method for manufacturing the printed-circuit board 10 includes a step of selectively forming a plating layer 16 becoming lands 22a, 22b on the metal foil 14 of the printed-circuit board 10, a step of regulating the thickness of the plating layer 16, and a step of forming the line 14a on the metal foil 14. The aspect ratio of the via hole 28 formed on the lands 22a, 22b can be regulated by regulating the thicknesses of the lands 22a, 22b. COPYRIGHT: (C)2005,JPO&NCIPI
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公开(公告)号:JP2001102749A
公开(公告)日:2001-04-13
申请号:JP26468499
申请日:1999-09-17
Applicant: IBM , NGK INSULATORS LTD
Inventor: TERADA KENJI , TSUKADA YUTAKA , SUZUKI TOMIO , ODAGIRI TADASHI
Abstract: PROBLEM TO BE SOLVED: To provide a circuit board formed to enhance reliability of three- dimensionally laid conductors, so that vias and buildup layer are not stressed by deformation due to the thermal expansion difference between the metal of the vias and an insulating material. SOLUTION: This circuit board 3 is composed of a base board 4, having a metal embedded at specified pitches as vias 20 into an insulating material which contains an epoxy resin and amorphous silica as main components and has an isotropic thermal expansion coefficient, and at least one of insulation layers and one of conductor layers laminated alternately on the base board 4.
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公开(公告)号:JPH08148566A
公开(公告)日:1996-06-07
申请号:JP28811494
申请日:1994-11-22
Applicant: IBM
Inventor: SHIRAI MASAHARU , TERADA KENJI , TSUKADA YUTAKA , TSUCHIDA SHUHEI
IPC: H01L21/28 , H01L21/48 , H01L21/768 , H01L23/522 , H05K3/00 , H05K3/46
Abstract: PURPOSE: To provide a method of manufacturing a semiconductor device proper to form a via hole for easily attaching a conductor layer uniformly to the via hole in a substantially bowl shape. CONSTITUTION: A photosensitive resin 3 is mounted on a substrate 1 so that thickness, in which the thickness is removed by the grinding of the photosensitive resin 3 in a post-process is added to final required thickness as an insulating layer, is obtained. A cavity is formed to the photosensitive resin 3 by a specified pattern by exposure, development and etching, and the photosensitive resin 3, to which the cavity if formed, is thermoset. When a photosetting layer 6a show by a dotted line and a part of a thermosetting layer 3a in Fig. are ground and removed, a via hole 9 having a substantially bowl shape is formed.
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公开(公告)号:JPH02304524A
公开(公告)日:1990-12-18
申请号:JP12616389
申请日:1989-05-19
Applicant: IBM JAPAN , TOSHIBA CORP
Inventor: TERADA KENJI , SHOJI MASAHITO
IPC: G02F1/13 , G02F1/1339 , G02F1/1341 , G02F1/1362
Abstract: PURPOSE:To prevent the destruction of a switching element due to static electricity and the pollution, the degradation, and the sticking of liquid crystal by short-circuiting the electrode of an array substrate and the earth part of a seal forming device to form a seal part, storing he required sufficient quantity of liquid crystal in a pool and injecting it by the horizontal system. CONSTITUTION:A conductive member 18 to short-circuit an electrode 16 connected to a switching element 21 of an array substrate 11 and a printing stage 22 as the earth part of a screen printer are electrically connected by a conductor 24 to form the sealing material. Liquid crystal 19 is stored in a liquid crystal pool part 15 provided on the array substrate 11 in vacuum, and the atmospheric pressure is restored, and the pressure difference and the osmotic pressure are used to inject the liquid crystal 19 to the gap between the array substrate 11 and a counter substrate 17 by the horizontal system. Consequently, it is unnecessary to execute the scribing process before liquid crystal injection, and this process is finally executed. The required sufficient quantity of liquid crystal 19 is stored in the pool part 15 to inject the liquid crystal. Thus, the destruction of the switching element due to the static electricity is prevented, and liquid crystal is injected without the pollution, the degradation, neither the sticking to unnecessary parts.
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公开(公告)号:JPH02235026A
公开(公告)日:1990-09-18
申请号:JP5704489
申请日:1989-03-09
Applicant: TOSHIBA CORP , IBM JAPAN
Inventor: TOMII HITOSHI , SUZUKI SHUNJI , NAKANO TETSUYA , TERADA KENJI
IPC: G02F1/13 , G02F1/1339 , G02F1/1341 , G09F9/30
Abstract: PURPOSE:To prevent a sealant from penetrating in the display region of a liquid crystal container or near the same at the time of sealing of a liquid crystal injection port and to improve the yield of a product by using the sealant into which particles having the diameter ranging 1.5 to 0.8 times the thickness of a liquid crystal layer. CONSTITUTION:The liquid crystal 5 is injected through the liquid crystal injection port 4 into the liquid crystal container 3 formed by sealing the circumference of two sheets of transparent electrode substrates 1a, 1b superposed apart 10mum spacing to form a liquid crystal layer by the sealant 2. This liquid crystal container 3 is then pressurized for about one hour under about 150g/cm pressure from the direction where the substrates 1a, 1b are superposed. The liquid crystal injection port 4 is then sealed by using the sealant formed by adding and incorporating particles 6 of about 11mum grain size to a UV curing resin and the sealant is irradiated with UV rays for about 30 seconds and is thereby cured. The penetration of the sealant in the display region of the liquid crystal display device produced in such a manner or near the same is not admitted at all.
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