公开(公告)号：CA1269343A

公开(公告)日：1990-05-22

申请号：CA500434

申请日：1986-01-27

Applicant: IBM

Inventor： HENNING TIMOTHY P ,  TOPA ROBERT D

IPC: C25D3/56

Abstract: PROCESS FOR THE DEPOSITION OF PALLADIUM-NICKEL ALLOY A palladium-nickel alloy is deposited onto a substrate by electroplating from a plating bath containing palladosammine chloride, nickel ion source, ammonium sulfate, ammonium chloride, and sufficient ammonium hydroxide to provide a pH of about 7.0 to about 8.3 at a temperature of about 60.degree.F to about 90.degree.F.

公开(公告)号：CA2024012A1

公开(公告)日：1991-02-26

申请号：CA2024012

申请日：1990-08-24

Applicant: IBM

Inventor： KANG SUNG K ,  PALMER MICHAEL J ,  REILEY TIMOTHY C ,  TOPA ROBERT D

IPC: B23K20/02 ,  B23K20/233 ,  B23K33/00 ,  H01L21/60 ,  H01L21/603

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.