公开(公告)号：IT1150089B

公开(公告)日：1986-12-10

申请号：IT2040880

申请日：1980-03-07

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  MASTER RAJ NAVINCHANDRA ,  TUMMALA RAO RAMAMAHARA

IPC: H05K3/46 ,  B32B17/00 ,  C03C10/00 ,  C03C27/00 ,  H01G4/30 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H01L

公开(公告)号：DE3071775D1

公开(公告)日：1986-10-30

申请号：DE3071775

申请日：1980-06-18

Applicant: IBM

Inventor： POWELL JIMMIE LEE ,  TUMMALA RAO RAMAMAHARA

IPC: C03C3/062 ,  B41J2/135 ,  B41J2/16 ,  C03C3/066 ,  C03C3/074 ,  C03C3/078 ,  C03C3/085 ,  C03C3/17 ,  C03C3/19 ,  C03C4/00 ,  C03C8/24 ,  C03C4/20 ,  B41J3/04

Abstract: 1. Alkaline ink-resistant multi-nozzle array for ink jet printers, where a number of glass nozzles are embedded in a glass substance, characterized in that the glass mass used for embedding the nozzles comprises the following oxides, bu weight % : PbO 45 - 53,5% Ge O2 0% SiO2 15 - 24,5% Zr O2 4,5% B2 O3 5 - 12% Mg O 0,5 - 1,5% ZnO 3,5 - 4,5% Ba O 0 - 1,5% Al2 O3 3 - 4% Ti O2 0 - 2% Na2 O 1 - 6,5% Ca O 0,5 - 1,5% CdO 2 - 3% La2 O3 0 - 0,5% Cu2 O 0 - 2%

公开(公告)号：IT8020408D0

公开(公告)日：1980-03-07

申请号：IT2040880

申请日：1980-03-07

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  MASTER RAJ NAVINCHANDRA ,  TUMMALA RAO RAMAMAHARA

IPC: H05K3/46 ,  B32B17/00 ,  C03C10/00 ,  C03C27/00 ,  H01G4/30 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H01L

公开(公告)号：DE3071771D1

公开(公告)日：1986-10-23

申请号：DE3071771

申请日：1980-06-18

Applicant: IBM

Inventor： POWELL JIMMIE LEE ,  TUMMALA RAO RAMAMAHARA

IPC: C03C3/062 ,  C03C3/16 ,  C03C4/20 ,  B41J3/04

公开(公告)号：DE3068834D1

公开(公告)日：1984-09-13

申请号：DE3068834

申请日：1980-01-16

Applicant: IBM

Inventor： NARKEN BERNT ,  TUMMALA RAO RAMAMAHARA

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L23/14

Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

公开(公告)号：IT8020407D0

公开(公告)日：1980-03-07

申请号：IT2040780

申请日：1980-03-07

Applicant: IBM

Inventor： BERNT NARKEN ,  TUMMALA RAO RAMAMAHARA

IPC: H01L21/48 ,  H01L23/12 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L

Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

公开(公告)号：IT1148832B

公开(公告)日：1986-12-03

申请号：IT2242580

申请日：1980-05-30

Applicant: IBM

Inventor： POWELL JIMMIE LEE ,  TUMMALA RAO RAMAMAHARA

IPC: B41J2/135 ,  C03C3/062 ,  B41J2/16 ,  C03C3/066 ,  C03C3/074 ,  C03C3/078 ,  C03C3/085 ,  C03C3/17 ,  C03C3/19 ,  C03C4/00 ,  C03C8/24 ,  B41J

Abstract: 1. Alkaline ink-resistant multi-nozzle array for ink jet printers, where a number of glass nozzles are embedded in a glass substance, characterized in that the glass mass used for embedding the nozzles comprises the following oxides, bu weight % : PbO 45 - 53,5% Ge O2 0% SiO2 15 - 24,5% Zr O2 4,5% B2 O3 5 - 12% Mg O 0,5 - 1,5% ZnO 3,5 - 4,5% Ba O 0 - 1,5% Al2 O3 3 - 4% Ti O2 0 - 2% Na2 O 1 - 6,5% Ca O 0,5 - 1,5% CdO 2 - 3% La2 O3 0 - 0,5% Cu2 O 0 - 2%

公开(公告)号：DE3060057D1

公开(公告)日：1982-01-14

申请号：DE3060057

申请日：1980-01-16

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  MASTER RAJ NAVINCHANDRA ,  TUMMALA RAO RAMAMAHARA

IPC: H05K3/46 ,  B32B17/00 ,  C03C10/00 ,  C03C27/00 ,  H01G4/30 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03