公开(公告)号：US3039005A

公开(公告)日：1962-06-12

申请号：US2101660

申请日：1960-04-08

Applicant: IBM

Inventor： O'CONNELL JAMES A ,  BERNT NARKEN

IPC: G02F1/00 ,  G09G3/02 ,  H03K17/78 ,  H05B33/12

CPC classification number: H05B33/12 ,  G02F1/00 ,  G09G3/02 ,  G09G3/30 ,  G09G2360/141 ,  H03K17/78

公开(公告)号：US3248261A

公开(公告)日：1966-04-26

申请号：US21730362

申请日：1962-08-16

Applicant: IBM

Inventor： BERNT NARKEN ,  BRIAN SUNNERS

IPC: C03C8/00 ,  G03G5/085

CPC classification number: C03C8/00 ,  G03G5/085 ,  Y10S430/136

公开(公告)号：US3225253A

公开(公告)日：1965-12-21

申请号：US16289661

申请日：1961-12-28

Applicant: IBM

Inventor： BERNT NARKEN ,  MILLER ALLAN S

IPC: H05B33/00 ,  H05B33/12 ,  H05B33/26

CPC classification number: H05B33/00 ,  H05B33/12 ,  H05B33/26

公开(公告)号：DE1907637A1

公开(公告)日：1971-01-21

申请号：DE1907637

申请日：1969-02-15

Applicant: IBM

Inventor： ISRAEL MAISSEL LEON ,  BERNT NARKEN ,  SUNNERS BRIAN

IPC: C23C14/35 ,  G03G5/153 ,  G11B5/72 ,  H01F41/18 ,  H01J37/34

Abstract: A transparent, protective coating overlies a photoconductive layer and is integral therewith. The coating, which has a resistivity at least equal to the dark resistivity of the photoconductive material, has a thickness in the range of 50A-4000A. The coating is deposited on the photoconductive layer by sputtering through utilization of a high frequency alternating voltage whereby the properties of the coating may be controlled. When applying the high frequency alternating voltage, the power is kept low to produce a relatively high compressive stress of the coating. Controlling the power results in controlling the compressive stress of the coating. The temperature of the photoconductive layer may be maintained at a sufficiently low temperature so that the photoconductive layer retains its photoconductive properties.

公开(公告)号：IT8020407D0

公开(公告)日：1980-03-07

申请号：IT2040780

申请日：1980-03-07

Applicant: IBM

Inventor： BERNT NARKEN ,  TUMMALA RAO RAMAMAHARA

IPC: H01L21/48 ,  H01L23/12 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L

Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.

公开(公告)号：CH481464A

公开(公告)日：1969-11-15

申请号：CH370569

申请日：1969-03-13

Applicant: IBM

Inventor： LEON ISRAEL MAISSEL ,  BERNT NARKEN ,  BRIAN SUNNERS

IPC: C23C14/35 ,  G03G5/153 ,  G11B5/72 ,  H01F41/18 ,  H01J37/34 ,  H01C7/08 ,  C23C15/00

公开(公告)号：CH542569A

公开(公告)日：1973-09-30

申请号：CH1199172

申请日：1972-08-14

Applicant: IBM

Inventor： BERNARD GREENSTEIN ,  PERRY R LANGSTON ,  BERNT NARKEN ,  MELVIN N TURETZKY

IPC: H01L21/48 ,  H01L23/14 ,  H01L23/538 ,  H05K1/03 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46 ,  H05K3/36

公开(公告)号：CH483078A

公开(公告)日：1969-12-15

申请号：CH411469

申请日：1969-03-19

Applicant: IBM

Inventor： LEON ISRAEL MAISSEL ,  BERNT NARKEN ,  BRIAN SUNNERS

IPC: C23C14/35 ,  G03G5/153 ,  G11B5/72 ,  H01F41/18 ,  H01J37/34 ,  C23C15/00