公开(公告)号：JP2002319253A

公开(公告)日：2002-10-31

申请号：JP2002110025

申请日：2002-04-12

Applicant: IBM

Inventor： TEIMOSHII JIYOSEFU CHIYAINAA ,  MAAKU DERORUMAN SUKARUTSU ,  WEBB BUCKNELL C ,  YARMCHUK EDWARD JOHN

IPC: G11B5/48 ,  G11B5/55 ,  G11B5/596 ,  G11B21/08 ,  G11B21/10 ,  G11B27/30

Abstract: PROBLEM TO BE SOLVED: To provide a system and a method for self-servowriting which are more flexible and to overcome the defects of known self-servowriting technology. SOLUTION: The method and system for self-servowriting to a data storage medium are disclosed and include a step or means for servo control over the propagation bursts of a propagation pattern arranged on a track other than a last track. A reference level used for positioning a recording head is kept within a usable dynamic range needed, to hold servo track intervals constant over the medium. The method and system are described, in relation to a rotary actuator having read and write heads at an interval. A similar method for writing a trigger or timing bursts of the propagation pattern is also disclosed.

公开(公告)号：JP2010263205A

公开(公告)日：2010-11-18

申请号：JP2010096609

申请日：2010-04-20

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： KATOPIS GEORGE A ,  BUCHWALTER STEPHEN L ,  TSAPEPAS STELIOS G ,  KNICKERBOCKER JOHN U ,  PAUL S ANDRY ,  WEBB BUCKNELL C

IPC: H01L23/12 ,  H01L23/32

CPC classification number: H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00 ,  H01L2224/05552

Abstract: PROBLEM TO BE SOLVED: To provide an interposer substrate assembly such that an integrated circuit chip can be reworked, and to provide an electronic device assembly and a method of manufacturing them. SOLUTION: A substrate 310 is fabricated of a material having a first thermal expansivity; and an interposer 330 is fabricated of a material having a second thermal expansivity different from the first expansivity. There is a coefficient of thermal expansion mismatch between the substrate 310 and the interposer 330 or chip 320. The interposer 330 is coupled to the substrate 310 via a first plurality of electrical contacts 315 and an underfill adhesive 316 at least partially surrounding the electrical contacts 315 to bond the interposer 330 to the substrate 310, thereby reducing strain applied on the first electrical contacts 315. The integrated circuit chip 320 is coupled to the interposer 330 via a second plurality of electrical contacts 325 without use of an adhesive surrounding the second plurality of electrical contacts 325. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种插入器基板组件，使得可以对集成电路芯片进行返工，并提供电子器件组件及其制造方法。 解决方案：衬底310由具有第一热膨胀性的材料制成; 并且插入件330由具有不同于第一扩展性的第二热膨胀性的材料制成。 衬底310和插入器330或芯片320之间存在热膨胀失配系数。插入器330经由第一多个电触点315和底部填充粘合剂316耦合到衬底310，至少部分地围绕电触头315 以将内插器330接合到基板310，从而减小施加在第一电触点315上的应变。集成电路芯片320经由第二多个电触点325而耦合到插入器330，而不使用围绕第二多个 电触点325.版权所有（C）2011，JPO＆INPIT

公开(公告)号：BR9505547A

公开(公告)日：1997-11-04

申请号：BR9505547

申请日：1995-11-28

Applicant: IBM

Inventor： YARMCHUK EDWARD JOHN ,  SCHULTZ MARK D ,  CHAINER TIMOTHY JOSEPH ,  WEBB BUCKNELL C

IPC: G11B5/596 ,  G11B21/10 ,  G11B5/55 ,  G11B5/58

公开(公告)号：CA2366415A1

公开(公告)日：1996-06-03

申请号：CA2366415

申请日：1995-11-24

Applicant: IBM

Inventor： YARMCHUK EDWARD JOHN ,  WEBB BUCKNELL C ,  SCHULTZ MARK DELORMAN ,  CHAINER TIMOTHY JOSEPH

IPC: G11B5/012 ,  G11B5/55 ,  G11B5/596 ,  G11B21/10

Abstract: During a write revolution of a storage medium, a transition is written on the storage medium while servoing on another transition previously recorded on the storage medium. During that write revolution, a position error signal corresponding to the position error of the transducer relative to the previously recorded transition is determined. That position error signal is then stored, during the write revolution, to be used in computing a reference track value associated with the transition being written to correct for the position error. Additionally, a product servo-pattern is written, which includes an embodying of the position error therein.

公开(公告)号：CA2365155A1

公开(公告)日：1996-06-03

申请号：CA2365155

申请日：1995-11-24

Applicant: IBM

Inventor： SCHULTZ MARK DELORMAN ,  CHAINER TIMOTHY JOSEPH ,  YARMCHUK EDWARD JOHN ,  WEBB BUCKNELL C

IPC: G11B5/012 ,  G11B5/55 ,  G11B5/596 ,  G11B21/10

Abstract: During a write revolution of a storage medium, a transition is written on the storage medium while servoing on another transition previously recorded on the storage medium. During that write revolution, a position error signal corresponding to the position error of the transducer relative to the previously recorded transition is determined. That position error signal is then stored, during the write revolution, to be used in computing a reference track value associated with the transition being written to correct for the position error. Additionally, a product servo-pattern is written, which includes an embodying of the position error therein.

公开(公告)号：CA2365103A1

公开(公告)日：1996-06-03

申请号：CA2365103

申请日：1995-11-24

Applicant: IBM

Inventor： WEBB BUCKNELL C ,  CHAINER TIMOTHY JOSEPH ,  YARMCHUK EDWARD JOHN ,  SCHULTZ MARK DELORMAN

IPC: G11B5/012 ,  G11B5/55 ,  G11B5/596 ,  G11B21/10

Abstract: During a write revolution of a storage medium, a transition is written on the storage medium while servoing on another transition previously recorded on the storage medium. During that write revolution, a position error signal corresponding to the position error of the transducer relative to the previously recorded transition is determined. That position error signal is then stored, during the write revolution, to be used in computing a reference track value associated with the transition being written to correct for the position error. Additionally, a product servo-pattern is written, which includes an embodying of the position error therein.

公开(公告)号：IL288745D0

公开(公告)日：2022-02-01

申请号：IL28874521

申请日：2021-12-07

Applicant: IBM ,  LEWANDOWSKI ERIC PETER ,  WEBB BUCKNELL C ,  HERTZBERG JARED BARNEY ,  SANDBERG MARTIN O ,  JINKA OBLESH

Inventor： LEWANDOWSKI ERIC PETER ,  WEBB BUCKNELL C ,  HERTZBERG JARED BARNEY ,  SANDBERG MARTIN O ,  JINKA OBLESH

IPC: G06N10/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/44 ,  H01L23/488 ,  H01L39/24

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.

公开(公告)号：DE102012103571B4

公开(公告)日：2013-12-05

申请号：DE102012103571

申请日：2012-04-24

Applicant: IBM

Inventor： SHAPIRO MICHAEL JAY ,  WASSICK THOMAS ANTHONY ,  INTERRANTE MARIO J ,  LAFONTANT GARY ,  WEBB BUCKNELL C

IPC: H01L23/50 ,  H01L21/283 ,  H01L21/60 ,  H01L21/768

Abstract: Halbleiterstruktur, umfassend: eine Silicium-Durchkontaktierung (TSV), welche sich durch die Halbleiterstruktur erstreckt; eine elektrisch leitende Kontaktfläche an einer Oberfläche der Halbleiterstruktur, wobei die TSV in Kontakt mit einer ersten Seite der elektrisch leitenden Kontaktfläche endet; eine Passivierungsschicht, welche die elektrisch leitende Kontaktfläche bedeckt, wobei die Passivierungsschicht eine Vielzahl von Öffnungen aufweist; und eine Vielzahl elektrisch leitender Strukturen, welche in der Vielzahl von Öffnungen und in Kontakt mit einer zweiten Seite der elektrisch leitenden Kontaktfläche ausgebildet sind, wobei der Kontakt der Vielzahl elektrisch leitender Strukturen mit der elektrisch leitenden Kontaktfläche in Bezug auf den Kontakt der TSV mit der elektrisch leitenden Kantaktfläche versetzt ist.

公开(公告)号：DE69507579T2

公开(公告)日：1999-08-12

申请号：DE69507579

申请日：1995-11-23

Applicant: IBM

Inventor： YARMCHUK EDWARD JOHN ,  SCHULTZ MARK D ,  WEBB BUCKNELL C ,  CHAINER TIMOTHY JOSEPH

IPC: G11B5/596 ,  G11B21/10 ,  G11B5/00 ,  G11B5/48 ,  G11B5/55 ,  G11B5/58

公开(公告)号：CA2365155C

公开(公告)日：2002-08-20

申请号：CA2365155

申请日：1995-11-24

Applicant: IBM

Inventor： SCHULTZ MARK DELORMAN ,  CHAINER TIMOTHY JOSEPH ,  YARMCHUK EDWARD JOHN ,  WEBB BUCKNELL C

IPC: G11B5/012 ,  G11B5/55 ,  G11B5/596 ,  G11B21/10

Abstract: A mechanism for servowriting on a storage medium of a storage device. The storage device has a transducer and a servo loop for positioning the transducer with respec t to the storage medium. At least one transition is written on a track of the storage medium, while servoing on other transitions previously recorded on the storage medium. A reference waveform is derived as a function of a closed loop response of the servo loop and a position error waveform. The position error waveform corresponds to one or more position errors of the transducer relative to the previously recorded transitions. The reference waveform is usable in writing subsequent tracks on the storage medium. Using the reference waveform for writing subsequent trac ks provides a substantial rejection of mechanical disturbances by the servo loop.