公开(公告)号：EP1834379A4

公开(公告)日：2010-02-24

申请号：EP05858193

申请日：2005-09-30

Applicant: IBM

Inventor： HOUGHAM GARETH GEOFFREY ,  AFZALI ALI ,  CORDES STEVEN ALLEN ,  COTEUS PAUL W ,  FARINELLI MATTHEW J ,  GOMA SHERIF A ,  LANZETTA ALPHONSO P ,  MORRIS DANIEL PETER ,  ROSNER JOANNA ,  YOHANNAN NISHA

IPC: H05K7/10

CPC classification number: H01R9/00 ,  B33Y80/00 ,  G01R1/06738 ,  G01R1/07314 ,  G01R3/00 ,  H01R13/2414 ,  H05K7/1061 ,  Y10T29/49002

公开(公告)号：WO2007001391A3

公开(公告)日：2007-12-13

申请号：PCT/US2005035324

申请日：2005-09-30

Applicant: IBM ,  HOUGHAM GARETH GEOFFREY ,  AFZALI ALI ,  CORDES STEVEN ALLEN ,  COTEUS PAUL W ,  FARINELLI MATTHEW J ,  GOMA SHERIF A ,  LANZETTA ALPHONSO P ,  MORRIS DANIEL PETER ,  ROSNER JOANNA ,  YOHANNAN NISHA

Inventor： HOUGHAM GARETH GEOFFREY ,  AFZALI ALI ,  CORDES STEVEN ALLEN ,  COTEUS PAUL W ,  FARINELLI MATTHEW J ,  GOMA SHERIF A ,  LANZETTA ALPHONSO P ,  MORRIS DANIEL PETER ,  ROSNER JOANNA ,  YOHANNAN NISHA

IPC: H01R4/58

CPC classification number: H01R9/00 ,  B33Y80/00 ,  G01R1/06738 ,  G01R1/07314 ,  G01R3/00 ,  H01R13/2414 ,  H05K7/1061 ,  Y10T29/49002

Abstract: Techniques or forming enhanced electrical connections are provided. In one aspect, and electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Abstract translation: 提供了技术或形成增强的电连接。 在一个方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。

公开(公告)号：WO2006137896A2

公开(公告)日：2006-12-28

申请号：PCT/US2005035322

申请日：2005-09-30

Applicant: IBM ,  HOUGHAM GARETH GEOFFREY ,  AFZALI ALI ,  CORDES STEVEN ALLEN ,  COTEUS PAUL W ,  FARINELLI MATTHEW J ,  GOMA SHERIF A ,  LANZETTA ALPHONSO P ,  MORRIS DANIEL PETER ,  ROSNER JOANNA ,  YOHANNAN NISHA

Inventor： HOUGHAM GARETH GEOFFREY ,  AFZALI ALI ,  CORDES STEVEN ALLEN ,  COTEUS PAUL W ,  FARINELLI MATTHEW J ,  GOMA SHERIF A ,  LANZETTA ALPHONSO P ,  MORRIS DANIEL PETER ,  ROSNER JOANNA ,  YOHANNAN NISHA

IPC: H01L21/02

CPC classification number: H01R9/00 ,  B33Y80/00 ,  G01R1/06738 ,  G01R1/07314 ,  G01R3/00 ,  H01R13/2414 ,  H05K7/1061 ,  Y10T29/49002

Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Abstract translation: 提供了一种用于电子设备的探针结构。 一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。 探针结构包括适于连接到测试装置的一个或多个其它接触结构。