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公开(公告)号：EP1834379A4
公开(公告)日：2010-02-24
申请号：EP05858193
申请日：2005-09-30
Applicant: IBM
Inventor： HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
IPC: H05K7/10
CPC classification number: H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
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公开(公告)号：JP2003273158A
公开(公告)日：2003-09-26
申请号：JP2003003619
申请日：2003-01-09
Inventor： FURMAN BRUCE KENNETH , SURENDRA MAHESWARAN , GOMA SHERIF A , KARECKI ANNA , KARECKI SIMON M , MAGERLEIN JOHN HAROLD , PETRARCA KEVIN SHAWN , PURUSHOTHAMAN SAMPATH , SAMBUCETTI CARLOS JUAN , VOLANT RICHARD PAUL , WALKER GEORGE FREDERICK
IPC: H01L23/52 , H01L21/288 , H01L21/3205 , H01L21/60 , H05K1/03 , H05K1/11 , H05K3/38
CPC classification number: H01L24/12 , H01L21/288 , H01L21/2885 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L2224/0401 , H01L2224/05571 , H01L2224/05599 , H01L2224/1146 , H01L2224/1147 , H01L2224/11849 , H01L2224/13022 , H01L2224/1308 , H01L2224/13083 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/13582 , H01L2224/13616 , H01L2224/13644 , H01L2224/13655 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/30105 , H05K1/0306 , H05K1/112 , H05K3/388 , H05K2201/0317 , H05K2201/09472 , H05K2201/09509 , H05K2201/10674 , H01L2224/45111 , H01L2224/13099 , H01L2924/00 , H01L2224/05552
Abstract: PROBLEM TO BE SOLVED: To provide a system making an interconnection with a quite high density by connecting device chips and a chip carrier by using a microjoint interconnect structure.
SOLUTION: In the system, a pair of device chips is mounted on a microjoint interconnect chip carrier by using a microjoint interconnect structure. The microjoint interconnect chip carrier comprises a multilayer substrate having a plurality of receptacles on its surface. A pair of microjoint interconnect pads corresponding to the receptacles is provided on the device chips. Interconnecting wiring enabling an interconnection between the device chips is provided between the receptacles.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：通过使用微型连接互连结构，通过连接器件芯片和芯片载体来提供使密度相当高的互连的系统。 解决方案：在系统中，通过使用微型连接互连结构将一对器件芯片安装在微型连接互连芯片载体上。 微型连接互连芯片载体包括其表面上具有多个插座的多层基板。 在器件芯片上设置一对对应于插座的微接点互连焊盘。 在插座之间设置能够实现器件芯片之间的互连的互连布线。 版权所有（C）2003，JPO
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公开(公告)号：WO2007001391A3
公开(公告)日：2007-12-13
申请号：PCT/US2005035324
申请日：2005-09-30
Applicant: IBM , HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
Inventor： HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
IPC: H01R4/58
CPC classification number: H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
Abstract: Techniques or forming enhanced electrical connections are provided. In one aspect, and electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
Abstract translation: 提供了技术或形成增强的电连接。 在一个方面，电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号：WO2006137896A2
公开(公告)日：2006-12-28
申请号：PCT/US2005035322
申请日：2005-09-30
Applicant: IBM , HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
Inventor： HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
IPC: H01L21/02
CPC classification number: H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
Abstract translation: 提供了一种用于电子设备的探针结构。 一方面，探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。 探针结构包括适于连接到测试装置的一个或多个其它接触结构。
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