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公开(公告)号:EP1834379A4
公开(公告)日:2010-02-24
申请号:EP05858193
申请日:2005-09-30
Applicant: IBM
Inventor: HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
IPC: H05K7/10
CPC classification number: H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
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公开(公告)号:WO2007001391A3
公开(公告)日:2007-12-13
申请号:PCT/US2005035324
申请日:2005-09-30
Applicant: IBM , HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
Inventor: HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
IPC: H01R4/58
CPC classification number: H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
Abstract: Techniques or forming enhanced electrical connections are provided. In one aspect, and electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.
Abstract translation: 提供了技术或形成增强的电连接。 在一个方面,电连接装置包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。
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公开(公告)号:WO2006137896A2
公开(公告)日:2006-12-28
申请号:PCT/US2005035322
申请日:2005-09-30
Applicant: IBM , HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
Inventor: HOUGHAM GARETH GEOFFREY , AFZALI ALI , CORDES STEVEN ALLEN , COTEUS PAUL W , FARINELLI MATTHEW J , GOMA SHERIF A , LANZETTA ALPHONSO P , MORRIS DANIEL PETER , ROSNER JOANNA , YOHANNAN NISHA
IPC: H01L21/02
CPC classification number: H01R9/00 , B33Y80/00 , G01R1/06738 , G01R1/07314 , G01R3/00 , H01R13/2414 , H05K7/1061 , Y10T29/49002
Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.
Abstract translation: 提供了一种用于电子设备的探针结构。 一方面,探针结构包括具有穿过其平面的一个或多个接触结构的电绝缘载体。 每个接触结构包括具有连续穿过载体平面的至少一个表面延伸的导电层的弹性体材料。 探针结构包括适于连接到测试装置的一个或多个其它接触结构。
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公开(公告)号:HU0104678A2
公开(公告)日:2002-03-28
申请号:HU0104678
申请日:1999-11-29
Applicant: IBM
Inventor: BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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公开(公告)号:CZ20011889A3
公开(公告)日:2002-02-13
申请号:CZ20011889
申请日:1999-11-29
Applicant: IBM
Inventor: BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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公开(公告)号:CA2352168A1
公开(公告)日:2000-06-08
申请号:CA2352168
申请日:1999-11-29
Applicant: IBM
Inventor: CORDES MICHAEL JAMES , BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas (10, 12, 15) of red, green and blue, are serially formed in an overall pixel area (9), on a transparent substrate (2), and after each individual color sub pixel element formation, a layer of protective transparent material (11, 14, 16) is applied over the individual sub pixel element (10, 12, 15) and the pixel area before formatio n of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability , reliability, yield, cost, and throughput.
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公开(公告)号:CA2352168C
公开(公告)日:2005-07-05
申请号:CA2352168
申请日:1999-11-29
Applicant: IBM
Inventor: CORDES STEVEN ALLEN , DOYLE JAMES PATRICK , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , BUDD RUSSELL ALAN
Abstract: Three component color sub-pixel element areas (10, 12, 15) of red, green and blue, are serially formed in an overall pixel area (9), on a transparent substrate (2), and after each individual color sub pixel element formation, a layer of protective transparent material (11, 14, 16) is applied over the individual sub pixel element (10, 12, 15) and th e pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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公开(公告)号:PL347975A1
公开(公告)日:2002-05-06
申请号:PL34797599
申请日:1999-11-29
Applicant: IBM
Inventor: BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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