公开(公告)号：DE502004011747D1

公开(公告)日：2010-11-18

申请号：DE502004011747

申请日：2004-05-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PASSE THOMAS ,  FERBER GOTTFRIED ,  SPECHT BENEDIKT

IPC: H01L21/48 ,  H01L23/498 ,  H01L25/16 ,  H05K1/03 ,  H05K1/11 ,  H05K3/40

公开(公告)号：DE10103084B4

公开(公告)日：2006-08-03

申请号：DE10103084

申请日：2001-01-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FERBER GOTTFRIED ,  PELMER REIMUND

IPC: H01L23/488 ,  H01L21/48 ,  H01L21/60 ,  H01L23/14 ,  H01L25/07 ,  H05K1/03 ,  H05K3/32

公开(公告)号：DE10043921A1

公开(公告)日：2002-03-21

申请号：DE10043921

申请日：2000-09-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHILLING OLIVER ,  FERBER GOTTFRIED

IPC: H03K17/0814 ,  H03K17/12 ,  H03K17/56

Abstract: Electronic circuits (101,102) are provided with at least one input load connection (121,122), an output load connection (141,142) and a control connection (161,162). An output compensation connection (13) is provided between the output load connections to keep the output load connections independent from each other while having the same electrical potential within a given time.

公开(公告)号：DE10353849B4

公开(公告)日：2009-05-07

申请号：DE10353849

申请日：2003-11-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FERBER GOTTFRIED ,  SPECHT BENEDIKT

IPC: H05K7/20 ,  H01L23/40

Abstract: A cooling device has a cooling element ( 3 ) and a pressing device ( 4 ) which presses the component ( 1 ) against the cooling element ( 3 ). The pressing device ( 4 ) is resilient and is connected to the cooling element in a positive fit in order to produce fixing means which fix the component ( 1 ) to the cooling element in a reliable manner, the fixing means being easy to produce and compact.

公开(公告)号：DE102005018116A1

公开(公告)日：2006-11-02

申请号：DE102005018116

申请日：2005-04-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SPECHT BENEDIKT ,  FERBER GOTTFRIED

IPC: H01L23/488 ,  H01L25/07 ,  H05K7/14

Abstract: The module has a carrier (10) with an electrical connection unit (30) arranged in a housing with an opening, where a sleeve (20) is inserted into the opening from an inner side of the housing. The connection unit is passed from the inner side of the housing through the sleeve. The carrier includes another opening, where a section of the connection unit protruding from the sleeve is passed through the latter opening. The connection unit and the sleeve are fixedly connected with the carrier by solder (40). The carrier is designed as an electrical circuit board.

公开(公告)号：DE102005018116B4

公开(公告)日：2009-07-02

申请号：DE102005018116

申请日：2005-04-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SPECHT BENEDIKT ,  FERBER GOTTFRIED

IPC: H01L23/488 ,  H01L25/07 ,  H05K1/18 ,  H05K7/14

公开(公告)号：DE102008051560A1

公开(公告)日：2009-04-23

申请号：DE102008051560

申请日：2008-10-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FERBER GOTTFRIED ,  SPECHT BENEDIKT

IPC: H01L23/053 ,  H01L21/52 ,  H01L25/07

Abstract: The power module (10) has a housing (21) with multiple receiving elements (32) and a carrier element (22). An elastic deformable cover (11) is arranged on the carrier element. The cover is deformed by the receiving elements and carrier element. A substrate (24) is attached at the housing, which carries a semiconductor chip (43). Multiple conductive lines (40) are provided, which are made of aluminum material or copper material. An independent claim is included for a method for mounting a power module.