1.
    发明专利
    未知

    公开(公告)号:DE50006747D1

    公开(公告)日:2004-07-15

    申请号:DE50006747

    申请日:2000-11-23

    Abstract: Layers are patterned with a lithography method during the fabrication of integrated circuits. A mask, which may be reflective or transmissive, for carrying out the method. The photosensitive layers are exposed to radiation that is emitted by a radiation source. The radiation lies in the extreme ultraviolet region and is guided via the mask onto the photosensitive layers.

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