2.
    发明专利
    未知

    公开(公告)号:DE10141025B4

    公开(公告)日:2007-05-24

    申请号:DE10141025

    申请日:2001-08-22

    Abstract: The invention provides a method for testing wafers ( 101 ) to be tested in a test device ( 100 ), in which the test device ( 100 ) can be calibrated, at least one calibration wafer ( 102 ) being automatically introduced into the test device ( 100 ) by means of a handling unit ( 103 ), calibration values of the test device ( 100 ) being determined by means of a control by a calibration sequence control unit ( 105 ), the calibration values determined being stored in a memory unit ( 106 ), the test device ( 100 ) being calibrated by means of the stored calibration values, the calibration wafer ( 102 ) being output from the calibrated test device ( 100 ), and at least one wafer ( 101 ) to be tested being introduced into the calibrated test device ( 100 ) by means of the handling unit ( 103 ) and being tested by a control by means of a test sequence control unit ( 104 ) in the calibrated test device ( 100 ), the stored calibration values being applied.

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