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公开(公告)号:DE102004022792A1
公开(公告)日:2005-08-11
申请号:DE102004022792
申请日:2004-05-08
Applicant: INFINEON TECHNOLOGIES AG
Inventor: OSTENDORF HANS-CHRISTOPH , ZIELBAUER JUERGEN
IPC: G11C7/20 , G11C11/4072
Abstract: A memory circuit (3) has a memory cells matrix (4), a control circuit (8) which is set into a first state with switch-on of the supply voltage to the memory circuit (3) and into a second state following initialization of the memory cells matrix (4). The control circuit (8), in the first state, blocks write and/or read of the memory cells matrix (4) and, in the second state, enables write and read of the memory cells matrix (4). An independent claim IS included for a method for driving a memory/storage circuit.
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公开(公告)号:DE10122081B4
公开(公告)日:2004-02-05
申请号:DE10122081
申请日:2001-05-07
Applicant: INFINEON TECHNOLOGIES AG
Inventor: OSTENDORF HANS-CHRISTOPH
IPC: G01R31/319 , G11C29/56 , G01R35/00 , G11C29/00 , G01R31/3183
Abstract: A method and an apparatus provides for calibrating a test system for an integrated semiconductor circuit, a pattern generator of the test system generating a test signal in the form of a pattern of successive rising and falling edges, which is composed of superposed sub-patterns formed via different internal paths of the pattern generator. The pattern generator provides an information signal for a measuring device of the test system, which identifies the edges of at least one sub-pattern of the test signal with regard to their origin from one of the internal paths. The calibration is carried out for the internal path separately using the information signal.
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公开(公告)号:DE10141025A1
公开(公告)日:2003-03-13
申请号:DE10141025
申请日:2001-08-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor: GREBNER THOMAS , SCHITTENHELM MICHAEL , OSTENDORF HANS-CHRISTOPH , THALMANN ERWIN
Abstract: A process for testing wafers in a test machine which can be calibrated automatically places a calibrating wafer (107) in the machine, calibrates it by means of a control unit and then inserts the wafer to be tested into the calibrated machine. An Independent claim is also included for a calibrating wafer for the above process.
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公开(公告)号:DE19952947A1
公开(公告)日:2001-05-23
申请号:DE19952947
申请日:1999-11-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KUND MICHAEL , OSTENDORF HANS-CHRISTOPH
Abstract: The read out device provides parallel read out of the register information held in a semiconductor chip using 2 or more input/output paths (I/O1,I/O2,...I/On), respectively associated with memory banks of the semiconductor chip via an input/output gating stage (2). The information is read out from the register, in which it is stored in the form of a number of fuses, via a multiplexer (4) operated in a test mode and line and column decoders (3,5) and entered in the memory banks via the input/output gating stage.
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公开(公告)号:DE102005007580B4
公开(公告)日:2015-10-29
申请号:DE102005007580
申请日:2005-02-18
Applicant: INFINEON TECHNOLOGIES AG
Inventor: OSTENDORF HANS-CHRISTOPH , OHLHOFF CARSTEN , GOLLMER STEFAN
IPC: G01R31/319 , G11C29/56
Abstract: Testvorrichtung zum Testen einer zu testenden Schaltungseinheit (101), welche Schaltungsuntereinheiten (102a–102n) aufweist, mit: a) einem Testsystem (200) zur Ausgabe von Testsignalen (201) zu der zu testenden Schaltungseinheit (101) und zum Auswerten von Antwortsignalen (202), die aus der zu testenden Schaltungseinheit (101) in Abhängigkeit von den dieser zugeführten Testsignalen (201) ausgegeben werden; b) einem Testerkanal (203) zum Anschließen der zu testenden Schaltungseinheit (101) an das Testsystem (200); und c) einer in der zu testenden Schaltungseinheit (101) angeordneten Verbindungseinheit (104) zum Verbinden des Testerkanals (203) mit den Schaltungsuntereinheiten (102a–102n) der zu testenden Schaltungseinheit (101), wobei mindestens eine erste Schaltungsuntereinheit (102a) ferner aufweist: d) eine erste Kompressions/Dekompressionseinheit (106a) zum Beschreiben der ersten Schaltungsuntereinheit (102a) in einem Dekompressionsmodus derart, dass die erste Schaltungsuntereinheit (102a) die Testsignale (201) erhält; dadurch gekennzeichnet, dass e) die der ersten Schaltungsuntereinheit (102a) der zu testenden Schaltungseinheit (101) von dem Testsystem (200) zugeführten Testsignale (201) in der ersten Kompressions/Dekompressionseinheit (106a) dekomprimiert werden; f) die erste Schaltungsuntereinheit (102a) in einen unkomprimierten Modus umschaltbar ist; g) mindestens eine zweite Schaltungsuntereinheit (102b) mit den dekomprimierten Testsignalen (201) aus der ersten Schaltungsuntereinheit (102a) beschrieben wird; h) Antwortsignale (202) aus der mindestens einen zweiten Schaltungsuntereinheit (102b) in die erste Schaltungsuntereinheit (102a) invertiert rückgeschrieben werden; und i) ein Kompressionsmodus durch die erste Kompressions/Dekompressionseinheit (106a) zum Auslesen der Antwortdaten (202) aus der ersten Schaltungsuntereinheit (102a) und zum Zuführen als Gesamt-Antwortdaten zu dem Testsystem (200) derart bereitgestellt wird, dass die aus der ersten Schaltungsuntereinheit (102a) der zu testenden Schaltungseinheit (101) ausgegebenen und dem Testsystem (200) zugefuhrten Antwortsignale (202) in der ersten Kompressions/Dekompressionseinheit (106a) komprimiert werden.
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公开(公告)号:DE10343388A1
公开(公告)日:2005-02-10
申请号:DE10343388
申请日:2003-09-19
Applicant: INFINEON TECHNOLOGIES AG
Inventor: BEER PETER , OSTENDORF HANS-CHRISTOPH , SKALITZ MATTHIAS
Abstract: The integrated circuit has a fuse memory (1) permanently storing a setting value for the integrated circuit, the latter brought into an output mode via a pre-defined setting value stored in the fuse memory, the setting value entered in the fuse memory after a programming step used for bringing the integrated circuit into an operating mode, with inactive switching of the fuse memory after the programming step by a switching device (8). A test circuit (9) switches the fuse memory into its inactive state upon a test mode, so that the integrated circuit is operated in its output mode with the pre-defined setting value.
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公开(公告)号:DE10116823A1
公开(公告)日:2002-11-07
申请号:DE10116823
申请日:2001-04-04
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HUEBNER MICHAEL , VASQUEZ BARBARA , OSTENDORF HANS-CHRISTOPH
Abstract: Device for calibrating test cards (100') with unsprung contact elements (50') that are used to test semiconductor wafers has: a probe arrangement (200') that has first (KSIG') and second (KSCH') signal contact surfaces; and a positioning device for positioning the probe device on the test card so that first and second signal contact surfaces connect to first and second test card contact elements (50'); whereby the first and second contact surfaces are attached in a sprung manner to the probe arrangement.
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公开(公告)号:DE10141025B4
公开(公告)日:2007-05-24
申请号:DE10141025
申请日:2001-08-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor: GREBNER THOMAS , SCHITTENHELM MICHAEL , OSTENDORF HANS-CHRISTOPH , THALMANN ERWIN
Abstract: The invention provides a method for testing wafers ( 101 ) to be tested in a test device ( 100 ), in which the test device ( 100 ) can be calibrated, at least one calibration wafer ( 102 ) being automatically introduced into the test device ( 100 ) by means of a handling unit ( 103 ), calibration values of the test device ( 100 ) being determined by means of a control by a calibration sequence control unit ( 105 ), the calibration values determined being stored in a memory unit ( 106 ), the test device ( 100 ) being calibrated by means of the stored calibration values, the calibration wafer ( 102 ) being output from the calibrated test device ( 100 ), and at least one wafer ( 101 ) to be tested being introduced into the calibrated test device ( 100 ) by means of the handling unit ( 103 ) and being tested by a control by means of a test sequence control unit ( 104 ) in the calibrated test device ( 100 ), the stored calibration values being applied.
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公开(公告)号:DE10116823C2
公开(公告)日:2003-10-30
申请号:DE10116823
申请日:2001-04-04
Applicant: INFINEON TECHNOLOGIES AG
Inventor: HUEBNER MICHAEL , VASQUEZ BARBARA , OSTENDORF HANS-CHRISTOPH
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公开(公告)号:DE19952947B4
公开(公告)日:2007-02-01
申请号:DE19952947
申请日:1999-11-03
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KUND MICHAEL , OSTENDORF HANS-CHRISTOPH
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