Patent search ap:("INFINEON TECHNOLOGIES AG") AND inv:"GROBITZSCH ELISABETH" Page 1

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发明专利
Regenerating semiconductor wafers mostly made from silicon comprises determining the extent of damage on the main surfaces of the wafer, grinding and chemical-mechanical polishing the surfaces, and wet chemical cleaning 未知

公开(公告)号：DE10137113A1

公开(公告)日：2003-02-27

申请号：DE10137113

申请日：2001-07-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KRAEMER HANS , GEIDL JOCHEN , HERRLICH LUTZ , GOEHLER JENS , MIMIETZ STEFFEN , GROBITZSCH ELISABETH , PATAKI ANETT

IPC: H01L21/302

Abstract: Regenerating semiconductor wafers mostly made from silicon comprises determining the extent of damage on the main surfaces of the wafer; grinding and chemical-mechanical polishing the surfaces; and wet chemical cleaning. Preferred Features: The grinding is carried out in the wet state using a diamond abrasive disk. Polishing is carried out in the presence of a polishing solution made from 0.26-normal tetramethylammonium hydroxide solution, 12 % silicon dioxide solution and 8 % aluminum sulfate solution. The wet chemical cleaning is carried out in the presence of 10-50 % hydrofluoric acid.

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