公开(公告)号：WO2005013352A3

公开(公告)日：2005-07-07

申请号：PCT/DE2004001667

申请日：2004-07-27

Applicant: INFINEON TECHNOLOGIES AG ,  FUERGUT EDWARD ,  KALIN THOMAS ,  VON KOBLINSKI CARSTEN ,  WOERNER HOLGER

Inventor： FUERGUT EDWARD ,  KALIN THOMAS ,  VON KOBLINSKI CARSTEN ,  WOERNER HOLGER

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/538

CPC classification number: H01L21/6835 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/3511 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method for the production of a semiconductor element with a plastic housing within which at least one semiconductor chip is arranged, is disclosed. The method comprises the following steps: preparation of a semiconductor wafer with semiconductor chips arranged in rows and columns which have active upper faces and back faces, whereby the active upper faces are provided with contact surfaces, separation of the semiconductor wafer into individual semiconductor chips, preparation of a support plate, provided on the upper face thereof with a thermosensitive adhesive, fitting the individual semiconductor chips on said support plate, whereby the individual semiconductor chips are placed with the active upper face thereof on the upper face of the support plate, production of a common support made from plastic housing mass on the support plate, said semiconductor chips being embedded in the plastic housing mass and removal of the support plate by heating the thermosensitive adhesive to a given defined temperature at which the thermosensitive adhesive loses the adhesive effect thereof.

Abstract translation: 有一种半导体装置的制造具有塑料外壳，其中至少一个半导体芯片被布置呈现，包括以下步骤的方法：提供一个半导体晶片具有排列成行和列，其具有有源上侧和后侧的半导体芯片，有源顶侧与 提供接触表面; 将半导体晶片分成单独的半导体芯片; 提供一个支撑板，该支撑板的上侧设有热敏粘合剂; 将该承载板放置在各个半导体芯片中，其中各个半导体芯片在承载板顶部带有其主动顶部; 在支撑板上制造由塑料外壳材料制成的共同载体，其中半导体芯片嵌入塑料外壳组合物中; 通过将热敏粘合剂加热到预定的限定温度来移除载体板，在此温度下热敏粘合剂失去粘合效果。

公开(公告)号：DE10140827A1

公开(公告)日：2003-03-13

申请号：DE10140827

申请日：2001-08-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  UNTERWEGER JOSEF ,  KALIN THOMAS

IPC: G03F7/42 ,  H01L21/00 ,  H01L21/301 ,  H01L21/68 ,  H01L21/58

公开(公告)号：DE10334576A1

公开(公告)日：2005-03-03

申请号：DE10334576

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  KALIN THOMAS ,  KOBLINSKI CARSTEN VON

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/538 ,  H01L23/04

Abstract: A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

公开(公告)号：DE10303460A1

公开(公告)日：2004-08-19

申请号：DE10303460

申请日：2003-01-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT ,  BINDER ALFRED ,  MATSCHITSCH MARTIN ,  KALIN THOMAS ,  MAUNZ INGOMAR

IPC: B23Q3/18 ,  B24B37/34 ,  H01L21/68

公开(公告)号：DE10334576B4

公开(公告)日：2007-04-05

申请号：DE10334576

申请日：2003-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WOERNER HOLGER ,  FUERGUT EDWARD ,  KALIN THOMAS ,  KOBLINSKI CARSTEN VON

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/04 ,  H01L23/538

Abstract: A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

公开(公告)号：DE10140827B4

公开(公告)日：2004-07-29

申请号：DE10140827

申请日：2001-08-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MATSCHITSCH MARTIN ,  UNTERWEGER JOSEF ,  KALIN THOMAS

IPC: G03F7/42 ,  H01L21/00 ,  H01L21/301 ,  H01L21/68 ,  H01L21/58