公开(公告)号：DE10303460A1

公开(公告)日：2004-08-19

申请号：DE10303460

申请日：2003-01-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER KURT ,  BINDER ALFRED ,  MATSCHITSCH MARTIN ,  KALIN THOMAS ,  MAUNZ INGOMAR

IPC: B23Q3/18 ,  B24B37/34 ,  H01L21/68

公开(公告)号：DE10337570A1

公开(公告)日：2005-03-17

申请号：DE10337570

申请日：2003-08-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KOBLINSKI CARSTEN VON ,  MAUNZ INGOMAR ,  MATSCHITSCH MARTIN ,  HOHENWARTER ERWIN ,  ZEBEDIN WERNER ,  MICHENTHALER NORBERT

IPC: B65D81/07 ,  B65D85/90 ,  H01L21/673 ,  H01L21/68

Abstract: Lodged free from rigid inflexible contacts in a transporting container (1) exclusively by means of absorbent elements (8) formed by elastomer spiral springs, a supporting plate (4) has a box (5) fastened on it to hold thin wafers.

公开(公告)号：DE10258508B3

公开(公告)日：2004-09-09

申请号：DE10258508

申请日：2002-12-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOHENWARTER ERWIN ,  KOBLINSKI CARSTEN VON ,  KROENER FRIEDRICH ,  MAUNZ INGOMAR

IPC: H01L21/302 ,  H01L21/304

Abstract: The semiconductor wafer (1) is circular and of uniform thickness (D A). Two circular grooves (6) are formed close together near the edge (2) and concentric with it. The two grooves have the same depth (T G) and width (B G). The centerline of the outer groove is a given distance (A W) from the edge of the wafer. The reinforcement (7) consists of layer of material strong in compression and tension covering one side of the edge. The layer has tapered edges and engages in the pair of keying grooves.