公开(公告)号：DE10234943B4

公开(公告)日：2004-08-26

申请号：DE10234943

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KEMPER FRANZ ,  MOECKEL JENS

IPC: H01L21/68 ,  H01L21/768 ,  H01L23/525

Abstract: A device for processing semiconductor wafers (3) has a rotatable wafer support (6) with a coaxial positioning system (7) and a processing device (1) movable radially across the wafer by a second positioning system (4,5). A positioning unit (8) determines the wafer position with respect to wafer features. An Independent claim is also included for a process to operate the above device.

公开(公告)号：DE10319541A1

公开(公告)日：2004-07-08

申请号：DE10319541

申请日：2003-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KEMPER FRANZ ,  HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/36 ,  H01L23/04

Abstract: The device has a semiconducting chip with a contact device on a first surface, a bearer above the surface without the contact extending laterally above the chip and a structured re-wiring device for electrically connecting the chip's contact device to the connector. The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. The device has a semiconducting chip (10) with a contact device (11) on a first surface for providing an integrated electrical component, a bearer (12) above the surface without the contact extending laterally above the chip and a structured re-wiring device (13) for electrically connecting the contact device of the chip to the connector (14). The re-wiring device is attached to the first surface of the chip and the corresponding surface of the bearer and the connector extends laterally over the width of the chip. AN Independent claim is also included for the following: (a) a method of manufacturing an inventive device.

公开(公告)号：DE10234943A1

公开(公告)日：2004-02-12

申请号：DE10234943

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KEMPER FRANZ ,  MOECKEL JENS

IPC: H01L21/68 ,  H01L21/768 ,  H01L23/525

Abstract: A device for processing semiconductor wafers (3) has a rotatable wafer support (6) with a coaxial positioning system (7) and a processing device (1) movable radially across the wafer by a second positioning system (4,5). A positioning unit (8) determines the wafer position with respect to wafer features. An Independent claim is also included for a process to operate the above device.