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    INTEGRATED CIRCUIT COMPRISING ELECTRIC CONNECTING ELEMENTS
    1.
    发明申请
    INTEGRATED CIRCUIT COMPRISING ELECTRIC CONNECTING ELEMENTS 审中-公开
    随着电动紧固件集成电路

    公开(公告)号：WO02075810A2

    公开(公告)日：2002-09-26

    申请号：PCT/DE0200822

    申请日：2002-03-07

    Applicant: INFINEON TECHNOLOGIES AG ,  LEHR MATTHIAS UWE ,  MOECKEL JENS ,  TOEBBEN DIRK

    Inventor： LEHR MATTHIAS UWE ,  MOECKEL JENS ,  TOEBBEN DIRK

    IPC: H01L21/82 ,  H01L23/525 ,  H01L23/528

    CPC classification number: H01L23/5256 ,  H01L23/525 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A first electric connecting element (15) and a second electric connecting element (20) are placed next to one another on a substrate (5) along a first direction (Y). The first electric connecting element (15) is located at a first distance (35) from the second electric connecting element (20). A first conductor track (40) and a second conductor track (45) are placed on the substrate (5), and the first conductor track (40) is connected to the first electric connecting element (15), and the second conductor track (45) is connected to the second electric connecting element (20). A third electric connecting element (25) and a fourth electric connecting element (30) are placed on the substrate (5), and the first conductor track (40) and the second conductor track (45) are placed between the third electric connecting element (25) and the fourth electric connecting element (30) and, at this location, are located at a second distance (50) from one another that is less than the first distance (35).

    Abstract translation: 上的基板（5）的第一电连接元件（15）和沿一第一方向（Y）的第二电连接元件（20）并排布置。 第一电连接件（15）具有第一距离（35）到第二电连接元件（20）。 第一导体轨道（40）和第二导体线路（45）被布置在所述基板（5）和第一导体轨道（40）被连接到所述第一电连接元件（15）和第二导体（45）上被连接到第二电连接元件 （20）。 它是在基板（5）和第一导体轨道（40）和所述第三电连接件（25）和第四之间的第二导体（45）上的第三电连接件（25）和第四电连接件（30） 布置的电连接元件（30），并具有从那里彼此的第二距离（50），其是大于所述第一距离（35）小。

    3.
    发明专利
    未知

    公开(公告)号：DE50203196D1

    公开(公告)日：2005-06-30

    申请号：DE50203196

    申请日：2002-03-07

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： LEHR UWE ,  MOECKEL JENS ,  TOEBBEN DIRK

    IPC: H01L21/82 ,  H01L23/525 ,  H01L23/528

    Abstract: On a substrate, first and second electrical connecting elements of an integrated circuit are disposed next to one another along a first direction. The first electrical connecting element is at a first distance from the second electrical connecting element. First and interconnects are disposed on the substrate, the first interconnect being connected to the first electrical connecting element and the second interconnect being connected to the second electrical connecting element. Third and fourth electrical connecting elements are disposed on the substrate and the first and second interconnects are disposed between the third and fourth electrical connecting elements and therebetween are at a second distance from one another, the second distance being smaller than the first distance.

    4.
    发明专利
    未知

    公开(公告)号：DE10112543A1

    公开(公告)日：2002-10-02

    申请号：DE10112543

    申请日：2001-03-15

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： MOECKEL JENS ,  TOEBBEN DIRK ,  LEHR MATTHIAS UWE

    IPC: H01L21/82 ,  H01L23/525 ,  H01L23/528

    Abstract: A first electric connecting element (15) and a second electric connecting element (20) are placed next to one another on a substrate (5) along a first direction (Y). The first electric connecting element (15) is located at a first distance (35) from the second electric connecting element (20). A first conductor track (40) and a second conductor track (45) are placed on the substrate (5), and the first conductor track (40) is connected to the first electric connecting element (15), and the second conductor track (45) is connected to the second electric connecting element (20). A third electric connecting element (25) and a fourth electric connecting element (30) are placed on the substrate (5), and the first conductor track (40) and the second conductor track (45) are placed between the third electric connecting element (25) and the fourth electric connecting element (30) and, at this location, are located at a second distance (50) from one another that is less than the first distance (35).

    6.
    发明专利
    未知

    公开(公告)号：DE10234943B4

    公开(公告)日：2004-08-26

    申请号：DE10234943

    申请日：2002-07-31

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： KEMPER FRANZ ,  MOECKEL JENS

    IPC: H01L21/68 ,  H01L21/768 ,  H01L23/525

    Abstract: A device for processing semiconductor wafers (3) has a rotatable wafer support (6) with a coaxial positioning system (7) and a processing device (1) movable radially across the wafer by a second positioning system (4,5). A positioning unit (8) determines the wafer position with respect to wafer features. An Independent claim is also included for a process to operate the above device.

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