公开(公告)号：DE102005054268A1

公开(公告)日：2007-05-24

申请号：DE102005054268

申请日：2005-11-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  KESSLER ANGELIKA ,  SCHOBER WOLFGANG ,  HAIMERL ALFRED ,  MAHLER JOACHIM

IPC: H01L23/36 ,  H01L21/50 ,  H01L23/12 ,  H01L23/50

Abstract: A semiconductor component (1) having at least one chip (2) comprises an active upper side (3) on a mounting substrate (4) with electrical contacts (5) connected to the substrate by bond wires (6). There is a cooling body (9) on the upper side with a solderable intermediate layer (7) between cooler and upper side by which the cooling body is joined by a solder connection. An independent claim is also included for a production process for the above.