公开(公告)号：DE102006049949B3

公开(公告)日：2008-05-15

申请号：DE102006049949

申请日：2006-10-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MAHLER JOACHIM ,  ENGL REIMUND ,  BEHRENS THOMAS ,  KUEBLER WOLFGANG ,  SANDER RAINALD

IPC: H01L25/04 ,  H01L23/48

Abstract: The module (1) has a semiconductor chip (3) including electrodes (5, 6) on a top side (7) of the chip. The chip and a control chip (4) are provided with different supply potentials. Flat conductors (31, 37) have external connections and a flat conductor chip island (9). The island defines an electrically conducting portion (10) and an insulation layer (11). The chip (3) is arranged on the electrically conducting portion and positively bonded on the insulation layer. The chip (3) has a rear side (13) including a large power supply electrode (14) for the application of a supply potential. An independent claim is also included for a method for the production of semiconductor modules.